Globalization is Dead: Part Three
In what is the third and final article our “turmoil series”, we focus on the potentially radical impact of changes taking place within the ...
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PTI Blog
Globalization is Dead: Part Two
As we referenced in our previous blog, three major trends in the form of de-globalization, economic nationalism and a return to the era of ...
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Globalization is Dead: Part One
Media headlines tell us that semiconductor chip industry had a robust 2024, with expected double-digit growth and an even better year ...
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Accelerate Your Production with Palomar Technologies’ Prepare for Manufacturing Service
In today’s competitive landscape, getting new equipment up and running efficiently is a critical factor in maintaining a strong production ...
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Leveraging Expertise in High-Tech Assembly Challenges
Embracing the Complexity of High-Tech Assembly In the ever-evolving world of technology, complexity is both a challenge and an opportunity. ...
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Optimizing Process Approach in Semiconductor Packaging
This blog is divided into two parts. The first deals with the general principles behind process optimization, the second gives some ...
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Expanding Assembly Service Capabilities at Palomar: A Leap Forward in Precision Manufacturing
As a leading provider of innovative die bonding and wire bonding solutions, Palomar Technologies has consistently pushed the boundaries of ...
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Hold Your Horses: Metaphors in Effective Technical Communication
Communication is at the heart of commerce. It is the vehicle by which buyer and seller align. It is also the heart of development. Many ...
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An Interview with Customer-Facing Program Manager, Christian Shu: Part 2
Christian Shu recently sat down with Marketing’s Alexis Wellong to explain his new customer facing role in Assembly Services. In this ...
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An Interview with Customer-Facing Program Manager, Christian Shu: Part 1
Christian Shu recently sat down with Marketing’s Alexis Wellong to explain his new customer-facing role in Assembly Services. In this ...
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Archimedes and the Semiconductor Chip
How do you construct a bridge across a broad channel of water when the middle is far too deep to build one or more of the needed interim ...
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Trajectory: The Motion of Semiconductor Technology as a Function of Time
Understanding where an idea came from, its context, how it was perceived by the original thinker, and the impact that idea made on the ...
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Around the World in Five Trends
With due apologies to Jules Vern and his famous novel, we begin our 2024 blog series with an opening theme of “Around the World in Five ...
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Supporting Chiplets and Other Advanced Packaging
While Engineers can get mildly enthusiastic about what the rest of the semiconductor industry perceives as unduly narrow areas of ...
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Handmade in the USA
Yes, we still need to do some things by hand. Such is our collective way at looking at the world, that most of us cannot imagine, that when ...
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Assembly Services Singapore: Supporting Supply Chain Security
De-globalization, also referred to as re-shoring, is a significant trend describing much of the dynamic characterizing the semiconductor ...
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The Circular Economy
The current pace of technological change is only matched by levels in geo-economic uncertainties, themselves without parallel in over a ...
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Anticipating Icebergs
Packaging development and process work marks the critical universe of small beginnings. Problems rightly anticipated in these earliest ...
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The Many Faces of Cost
Many of us are familiar with the saying concerning the workman and his tools. It exposes the unfortunate tendency that, when looking upon ...
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Worth Its Salt
Almost everyone has heard the saying “worth its salt”, meaning whatever has been purchased, the financial cost was more than justified by ...
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If the Shoe Fits...
As we have noted in a previous blog, the die-bonding ecosystem has grown significantly in market size since the turn of the millennium, and ...
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Full Service Bonders
The principle of inference is a practice in science that allow us to identify the impact or nature of something that is challenging, if not ...
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Supporting Solutions Creativity
A well-known Danish Children’s toy company, with theme parks around the world, has recently launched its latest product aimed at grown-ups, ...
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FSO/AI Pushing Data Access and Evolution
In a previous article, we noted that the next generation of 6G and quantum encrypted communications will require the extensive use of free ...
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Global Innovation 101
Risk reduction is the essence of sound business behavior, but it is often misunderstood as merely “playing safe”. Playing safe can actually ...
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Digital Nose Technologies
In earlier blogs we considered new technologies that utilize light in the advance of health care, and the various challenges these ...
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Diamonds are an RF Engineer’s Best Friend
In less than two decades the RF “family” has witnessed significant growth in the types and varieties of technology served, materials ...
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Wedge Bonding and its Advantages
To begin, let’s start with a brief overview of wedge bonding. Unlike ball bonding, wedge bonding does not have a flame-off action, as there ...
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Case Study: The Unintended Consequences of a Design Change
Palomar Innovation Centers are experts in process development and work with customers in the areas of design for manufacture, process ...
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Systems, Tools, and Processes for Void-Free Die Attach
Using the correct system, tooling, process, and making wise material choices while considering material preparation are all factors and ...
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Challenging Packaging Trends in Cancer Photonics
In the blog, we review some of the theoretical principles in exploiting light for diagnostic and therapeutic uses in healthcare, and in ...
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Plating Requirements for Soldering Applications
Surfaces to be soldered in a flux-less environment must be coated prior to soldering. The most common solderable metallic coatings that are ...
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Design for Manufacturing – Increasing Throughput to Achieve ROI
When designing semiconductor packaging, it is often easy to get caught up focusing on the function and performance of a design and not pay ...
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Scaling up from Prototype to Full-Scale Production
The journey from concept to full-scale semiconductor packaging is often hindered by a number of different obstacles along the way including ...
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Case Study: Maximizing a High-Mix Process for High Volume Production
Palomar Innovation Centers are experts in process development and work with customers in the areas of design for manufacture, process ...
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Case Study: Reducing Process Steps to Improve Throughput
Palomar Innovation Centers are experts in process development and work with customers in the areas of design for manufacture, process ...
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A Tale of Two Bonders
It was the best of times; it was the worst of times. Yet, as always, the need is to make the most of the times. In the world of bonders and ...
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FMCW LiDAR – The hottest topic in the current photonics industry
While the challenges to fully developing FMCW (frequency modulated continuous wave) LiDAR technology appear steep, the commercial value of ...
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New Spokes in Global Defense
In the same way that a good craftsman chooses with care the right tools for the job, global defense planners are adapting their strategies ...
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Best Practices for Maximizing Productivity and Efficiency on Semiconductor Packaging Equipment
Capital equipment investments are justified on the basis of providing a return on investment. Capital equipment for the semiconductor ...
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Obstacles and Opportunities in 2022
The headwinds of inflationary trends, pandemic management, internal political tensions, rising competitiveness, supply chain issues, ...
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Process Control Techniques for Manufacturing RF Power Amplifier Assemblies
The RF power amplifier market is expected to increase substantially in the next five years, primarily as a result of the 5G rollout which ...
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When Contract Manufacturing Makes Sense - Delivering Faster ROI for Semiconductor Packaging
With today’s rapidly changing technology, time-to-market is one of the most important factors for product success. The ability to rapidly ...
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Developments in Undersea Fiber Optics and Packaging – 2022 and Beyond
The window from Palomar’s UK Innovation Center top floor office looks towards the Cornish coast, not too far from where Google’s Grace ...
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Modern Wedge Bonding
Over the years, microelectronic wire bond process and packaging engineers have debated whether to use ball or wedge bond technologies. This ...
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6G Communications: A Truly Quantum Leap
Our opening graphic contains three illustrations. Moving from left to right, these are respectively those of a stream engine, a nuclear ...
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Packaging Technologies meet Quantum Opportunities – Part Three
In part three of our series on Packaging Technologies meet Quantum Opportunities, we present an overview of how KETS Quantum Security, Bay ...
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Efficient Manufacture of IR Sensors
The market for the IR sensing devices has been growing steadily, but in recent years, the market experienced a rapid growth. Several ...
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Logistic Sensor Packaging – Part 3: Overcoming Assembly Challenges of Sensor Semiconductors
This is Part 3 of a 3-part blog series on Logistic Sensor Packaging. For more information, read Part 1 and Part 2. For device ...
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Logistic Sensor Packaging – Part 2: Robots, Cobots, Automation and Autonomy
This is part 2 of a 3-part blog series on Logistic Sensor Packaging. For more information, read Part 1. As a technical discipline, robotics ...
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Logistic Sensor Packaging – Part 1: Megatrends and Their Impact on Sensors
The next few years hold out sensor opportunities concomitant to the spectacular growth in global robotics. One of the key drivers for the ...
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Case Study: Reducing Power Module Failures on Large Substrates
Power electronics are present in our everyday lives in many applications. High-efficiency lighting, elevators, motor converters, solar ...
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Key Metrics of RF Power Transistor Manufacturing: GaN on SiC vs LDMOS
When it comes to the die bonding process for the assembly of RF power transistors, the most important metric is good thermal management. ...
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Sensors in New Era Defense
One of the great shifts currently taking place in global defense sensor technologies, is due to a fundamental realignment of military ...
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Calculating ROI when Purchasing Die or Wire Bonder Equipment
A traditional means to justify the expense of purchasing new bonding equipment is to calculate the units per hour (UPH) of the proposed ...
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Packaging Technologies Meet Quantum Opportunities: Part Two
In Part two of our series on Packaging Technologies meet Quantum Opportunities, Palomar’s Dr. Anthony O’Sullivan interviews Dr. Andrew ...
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The Resurgence of Brand Value
In the early part of 2021, global analysts McKinsey & Company published a number of articles noting that the COVID crisis has led, ...
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Packaging Technologies Meet Quantum Opportunities
This is the first in a 3-part blog series exploring the world of quantum technologies and its impact on semiconductor packaging. With the ...
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Die Bond Flexibility for Next Generation Photonics Packaging
Much of the semiconductor packaging industry is engaged with an exciting and growing photonics ecosystem. Anticipating seven percent CAGR ...
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Improve Wire Bond Capability and Reliability Through Use of Auxiliary Wires
Auxiliary wires are commonly defined as an additional wire outside of a normal ball-to-stitch wire bond. Whether it be a pre-wire, ...
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Interoperability Across Security, and Defense Ecosystems
“Necessity”, quips the proverb, “is the mother of invention.” Put colloquially, if you are desperate enough to attain a particular goal, ...
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Aerospace and Defense: 2021 and Beyond, Part 2
“New space technologies … will bring about fundamental change that will influence business and our personal lives.” George Whitesides, ...
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Aerospace and Defense: 2021 and Beyond
As global COVID-19 management enters a particularly challenging race between deepening health crises and the efficacy of vaccination, all ...
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2020 in Retrospect. What's in store for 2021?
As we reflect on the events of 2020 and anticipate their unfolding in 2021, our vision sharpens to reveal a clear trifecta of forces ...
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Looking forward to 2021 – Building upon the strengths and learnings of 2020
The year of 2020 will no doubt go down in history as one of the most difficult, life-changing years of the past century. At the beginning ...
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Achieving less than 1% voiding in GaN die attach processing
The die bonding, or die attach process, consists of attaching a die/chip to a substrate or package. This attachment can be performed with ...
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Achieving High Accuracy Pattern Recognition for Die Bonding
When it comes to microelectronics and photonics packaging assembly, components such as die are placed onto packages. All automated die ...
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Flexibility for Diverse Semiconductor Prototyping & Process Development
Process development can present many challenges in the die attach market when the optimal process or package design varies drastically. ...
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Automatic Epoxy Die Attach
Epoxy die attach, sometimes referred to as epoxy die bonding, is the most commonly used die attach method. Whether dispensed or daubed via ...
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Eutectic Die Attach: A Highly Reliable Solution for Advanced Materials and Automation Challenges
Eutectic die attach involves bonding a chip or die to a surface using a solder alloy. These particular solder alloys are used because of ...
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Power Modules Fuel the EcoPower Revolution
With all eyes on 2050 and the mid-century point, a highly ambitious series of global programs are in place to reduce carbon emissions ...
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Aerospace and Defense Competitive Strategies for the 2020s
In the same way that iron, steam, and the telegraph marked a mega-shift in travel and military technologies for the mid-Victorian era, new ...
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Pressure-less Silver Sintering for RF Power Electronics, Part 4 of 4 (应用于射频功率器件的无压银烧结技术，第4篇，共4篇)
[For the English version of this blog, please click here.] ...
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Pressure-less Silver Sintering for RF Power Electronics, Part 3 of 4 (应用于射频功率器件的无压银烧结技术，第3篇，共4篇)
[For the English version of this blog, please click here.] 在本系列的第3篇日志中，我们将介绍在喷射点胶应用的研究成果。正如我们之前在本日志系列的第2篇中所解释的，经过Palomar开发的Fixed ...
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Pressure-less Silver Sintering for RF Power Electronics, Part 2 of 4 (应用于射频功率器件的无压银烧结技术，第2篇，共4篇)
[For the English version of this blog, please click here.] ...
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COVID-19 and the Pre-existing Trends in Aerospace - Part 2
Our first blog examined the potential importance of three new technologies on the aerospace market over the next half-decade. These were ...
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Pressure-less Silver Sintering for RF Power Electronics, Part 1 of 4 (应用于射频功率器件的无压银烧结技术，第1篇，共4篇)
[For the English version of this blog, please click here.] ...
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Lid Sealing versus Seam Sealing
While lid sealing has been around for many years and is considered a legacy technology, it is helpful to revisit the topic and consider how ...
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COVID-19 and the Pre-existing Trends in Aerospace - Part 1
Before the COVID-19 pandemic, passenger numbers had been expected to double over the next 15 years, meaning significant growth in aerospace ...
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HYBOND, Inc., a Palomar Technology Partner, Introduces the DFS-IV Universal Wire Bonder Test Unit Product Line
HYBOND’S DFS-IV is a lightweight, compact, hand portable touch screen instrument for measuring force, ultrasonics generator board output ...
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Combining Bonder and Vacuum Reflow Technologies for High-Reliability Packaging – Case #2 Optical Transceivers
In our last blog on combining bonder and vacuum reflow technologies, we presented a case for how to combine these technologies to ...
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Disruption and Innovation in the Aerospace and Defense Eco-System
"Traditional defense organizations must adapt in order to keep the nations they serve safe. The world now exists at an economic, strategic, ...
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Palomar Innovation Centers Open and Fulfilling Customer Needs
In light of the global and local travel restrictions during this COVID-19 pandemic, we want to assure you that Palomar Technologies ...
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Forecasting the 2020 Micro-Optoelectronics Business During COVID-19
The COVID-19 situation is a textbook “black swan event” for the world. The unprecedented nature of this crisis makes it difficult to ...
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Reimagining the Aerospace and Defense Habitat
“Defense companies are now facing a real crisis that they cannot afford to ignore. In every region of the world, defense ministries are ...
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Update on COVID-19
As we are all aware, COVID-19 is having a dramatic impact on our lives. Palomar Technologies is a key supplier to critical infrastructure ...
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Low Latency Manufacturing for Biophotonics and Medical Device Packaging
The medical device market is expected to diversify significantly, almost double in value to $90 billion by 2025, but vendors face ...
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Combining Bonder and Vacuum Reflow Technologies for High-Reliability Packaging
It is not uncommon to see several different kinds of back-end assembly machines operating within close proximity to one another on a ...
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Pressure-less Silver Sintering for RF Power Electronics, Part 4 of 4
The earlier blogs in this series highlighted a number of pressing dynamics in the current direction of the RF power packaging ecosystem, ...
Posted by Dr. Anthony O'Sullivan on
Pressure-less Silver Sintering for RF Power Electronics, Part 3 of 4
In the third part of this blog series, we outline our technical success in demonstrating the use of jet dispensed silver sintering. As we ...
Posted by Dr. Anthony O'Sullivan on
Grateful for 2019, Looking Forward to a Prosperous 2020
As we entered into 2019, I think everyone in the industry was aware that the global semiconductor market was going to offer challenges to ...
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Pressure-less Silver Sintering for RF Power Electronics, Part 2 of 4
In this second blog on pressure-less silver sintering, we set out aspects of the development work we undertook at our Innovation Center in ...
Posted by Dr. Anthony O'Sullivan on
Pressure-less Silver Sintering for RF Power Electronics, Part 1 of 4
Silver sintering technology has been around since the 1980s, but the process has faced numerous problems. The limits of traditional ...
Posted by Dr. Anthony O'Sullivan on
Introduction to Sustainable Pressure-less Silver Sintering RF GaN
This blog is a snippet of larger technical paper, due for release in Q4 2019, written on the topic of eco-sustainability for packaging of ...
Posted by Redzuan Zin on
Palomar Presents at EPIC's Packaging Conference
Palomar Technologies recently sent two delegates to EPIC’s Packaging Conference, hosted by ASM Amicra, in Regensburg, Germany. The annual ...
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Delivering Higher Reliability, Higher Quality Power Modules
Power Semiconductors have enjoyed steady growth for at least the last 15 years, with only the occasional down turn. It is expected that the ...
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Creating the Cost Competitive LiDAR Solution for Mass Autonomous Vehicle Rollout
There is a multi-trillion-dollar market developing around the world through the adoption of disruptive technology in driverless vehicles. ...
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Bridging the Valley of Death: Meeting Advanced Microelectronic and Photonic Packaging Needs
Over the past several years, R&D spending, innovation, and invention has increased in Asia as these economies become more developed and ...
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Photonics Lights the Way for Smart Cities Around the World
Today, Singapore, London and Dubai lead the world when it comes to powering a world-class smart nationi, bypassing tech-savvy capitals like ...
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Product Discontinuation Program for Palomar 2460, 2470 and 3500 Bonders
Palomar Technologies has a long history of serving the microelectronics and photonics markets and has provided high quality equipment and ...
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Finding the Right Solution to Achieve Gold Planar Bumps for Flip Chip Bonding with Challenging Specifications
The semiconductor packaging industry continues a relentless pursuit to make smaller packages with higher throughput. The industry demand ...
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Happy New Year from Palomar Technologies' CEO and President
As we finish another record year at Palomar Technologies, we remain grateful for the collaborative relationships we enjoy with our ...
Posted by Bruce W. Hueners on
A Note From the President of SST Vacuum Reflow Systems
As we look forward to 2019, I’d like to take a moment to reflect on SST’s achievements in 2018, and to thank our customers, with whom we ...
Posted by Anthony J. Wilson on
Using Outsourced Manufacturing and Assembly for Advanced Photonic/Optoelectronic Chip Packages
Find out more about what Palomar Technologies Assembly Services™ has to offer, or contact us for more details. ---- Nick Evans Applications ...
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Keys to Maximizing Bonder Productivity
Can your manufacturing facility afford to lose $100,000 an hour to machine downtime? According to Information Technology Intelligence ...
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Rapid Deployment of Photonic Chip Packages: From Prototype to Production using Outsourced Manufacturing
Photonic integrated circuits (PIC) have become an attractive platform for data center, sensing and medical devices. Thermal cameras and ...
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Optoelectronic and RF Wireless Technologies Enabling IPL Cricket Finals Via Live Streaming
On May 27, 2018, the Indian Premier League (IPL) Final will be played at Wankhede Stadium in Mumbai. Millions of fans are expected to be ...
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RF GaN Die Bonding for a SMART Era
RF GaN’s Millennial Progression Since the early 2000s, the RF market has witnessed significant amounts of investment (individual, industrial ...
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Engaging Rapidly Changing Ultra-Tech Commerce: Part Two
The following blog is the conclusion of a two-part finale ending a series of eight examining Current Trends in the Opto-micro-electronic ...
Posted by Dr. Anthony O'Sullivan on
Engaging Rapidly Changing Ultra-Tech Commerce: Part One
The following blog is the first in a two-part finale ending a series of eight examining Current Trends in the Opto-micro-electronic and RF ...
Posted by Dr. Anthony O'Sullivan on
Engaging the Rapid Shift in World-Views
The following blog is the seventh in a series of eight examining Current Trends in the Opto-micro-electronic and RF Packaging Eco-systems, ...
Posted by Dr. Anthony O'Sullivan on
Palomar Technologies at SEMICON China 2018
Recently, Palomar Technologies attended SEMICON China in Shanghai and the OFC Show in San Diego, CA. The following are our impressions of ...
Posted by Anthony J. Wilson on
Rapidly Changing Commercial Dynamics/Market Drivers
The following blog is the fifth in a series of eight examining Current Trends in the Opto-micro-electronic and RF Packaging Eco-systems ...
Posted by Dr. Anthony O'Sullivan on
Introducing the NEW 6532HP by Palomar Technologies
Our latest blog interrupts the series on Current Trends in the Opto-micro-electronic and RF Packaging Eco-systems to bring readers ...
Posted by Dr. Anthony O'Sullivan on
Rapidly Changing Manufacturing Protocols
The following blog is the fourth in a series of eight examining Current Trends in the Opto-micro-electronic and RF Packaging Eco-systems ...
Posted by Dr. Anthony O'Sullivan on
Rapidly Changing Market Dynamics
The following blog is the third in a series of eight examining Current Trends in the Opto-micro-electronic and RF Packaging Eco-systems, ...
Posted by Dr. Anthony O'Sullivan on
Rapidly Changing Demand
This blog is the second in a series of eight examining Current Trends in the Opto-micro-electronic and RF Packaging Eco-systems giving ...
Posted by Dr. Anthony O'Sullivan on
Opto-micro-electronic and RF Packaging Eco-systems
The following blog is the first in a series of eight examining Current Trends in the Opto-micro-electronic and RF Packaging Eco-systems ...
Posted by Dr. Anthony O'Sullivan on
MEPTEC Report Feature Article
The Microelectronics Packaging & Test Engineering Council (MEPTEC) began over 30 years ago, and provides a forum for semiconductor ...
Posted by Janine Powell on
Happy New Year from Palomar Technologies
While we are now in what is called the "information age", it is easy to lose sight of the foundation of this information age—namely the ...
Posted by Janine Powell on
Manual Load, Island of Automation, or In-Line: What is the Right Solution for my Process?
Often customers are wrestling with the question of which option makes more sense in their given business environment: a manual system, ...
Posted by Janine Powell on
Selecting a Wedge Bonder (Выбор устройства Клин-Бондерa)
[For the English version, click here.] В начале 80-х годов компания Palomar/Hughes начала разработку и производство Клин-Бондеров для ...
Posted by Janine Powell on
New Processes and Technologies Drive Micro/Optoelectronics Packaging
The relentless increase in data processing requirements, network/cloud services, computing and web bandwidth advances, and soon-to-be-seen ...
Posted by Janine Powell on
Pattern Recognition Software that Works Like the Human Eye and Brain
Standard bonding machine pattern recognition vision systems (auto correlation based) today determine their location based on a “pixel to ...
Posted by Janine Powell on
New Advances in Ultra-Short Bond Span and Ultra-Low Loop Profile
The proliferation of mobile devices, IP traffic, video-on-demand mobile and home, and Internet of Things continues to drive an exponential ...
Posted by Janine Powell on
Ball and Wedge Bonders & Loop Mode Development
The Palomar Technologies 8000i Wire Bonder/Ball (Stud) Bumper and 9000 Wedge Bonder both have a good selection of wire bonding “loop modes” ...
Posted by Janine Powell on
Capabilities for Gold Ball Bumping Die
Gold ball bumping is primarily used to make interconnects for flip chip bonded die. This process involves placing a single bump (or stacked ...
Posted by Janine Powell on
Active Optical Cable Transceiver Packaging Trends and Die Bonding Case Studies
The market dedicated to optoelectronic packaging with active optical cables and/or optical transceivers is an important one in which ...
Posted by Janine Powell on
Consequences of High Voids in the Package Seal Ring (封装密封圈中高空隙的后果)
[For the English version, click here.] “如果您正在生产高价值的密封元件，在封装密封环中产生高空隙的后果是什么？” 封装密封圈中高度的空隙可能会导致泄漏故障，从而降低元件的可靠性和性能。 ...
Posted by Janine Powell on
Automatic Systems Require Superior Vision
When it comes to microelectronics assembly, there are many challenges and solutions. One of the most critical differences between a manual ...
Posted by Janine Powell on
Benefits of Reverse Wire Bonding & Stand-Off Stitch (Les avantages du câblage inverse et du stitch sur bump)
[For the English version of this blog, click here.] Les interconnexions en câblage filaire dans l’électronique on traditionnellement été ...
Posted by Janine Powell on
History of Ball Bonding Flame-Off and Advanced Concepts
Last year, I wrote a blog about general EFO theory. This edition will focus on the history of the “flame-off” and a few more advanced ...
Posted by Janine Powell on
Consequences of High Voids in the Package Seal Ring
“If you are creating high value hermetically sealed devices, what are the consequences of experiencing high voids in the package seal ...
Posted by Katie Finney on
Consequences of High Voids in Hermetically Sealed Devices
“If you are creating high value hermetically sealed devices, what are the consequences of experiencing high voids in the package seal ...
Posted by Julia Picarelli on
Why or When One Should Use a Vacuum/Pressure Reflow Oven System as Opposed to Other Packaging Technology Systems ...
[View the blog in English here.] 今天, 绝大部分的高生产焊接电子元器件应用都 使用带式焊炉。带式焊炉的典型长度超过20英尺。这些高批量生产流程需要 <200 ppm 氧气水平, 氮气冲洗 (以达到如此低的 ppm 氧气水平) 和恒定的 ...
Posted by Janine Powell on
High Vacuum MEMS Sealing Technology
Microelectronic Mechanical Systems, or MEMS, technology is everywhere we look. The biotech, medical device, communications, and inertial ...
Posted by Janine Powell on
Preventative Maintenance for SST Vacuum Furnace Tooling
The specialized semiconductor grade graphite tooling manufactured by SST Vacuum Reflow Systems can be used for many years with proper ...
Posted by Julia Picarelli on
Immediate Production Required: Need to Build Parts Soon?
Sometimes we get requests from customers or potential customers needing a bonder right away. Of course, we try to do everything we can to ...
Posted by Janine Powell on
MEMS, MEMS, MEMS!
MEMS technology is everywhere we look. The Biotech, Medical Device, Communications and Inertial Sensing segments are increasingly using ...
Posted by Julia Picarelli on
Achieving an Advanced Degree: Pulsed Heat & Steady State Heater Stages
In many bonding applications, whether for die attach or wire bond, a successful bond can depend greatly on the method by which the parts ...
Posted by Janine Powell on
Software: Big Feature, Small Feature, and More Features on the Way
Palomar Technologies modern bonding systems have a multi-decade history, with system software that has been continuously improved upon in ...
Posted by Janine Powell on
Why or When One Should Use a Vacuum/Pressure Reflow Oven System
Today, in the majority of high production soldering of electronic component applications, belt furnaces are used. The typical length of a ...
Posted by Julia Picarelli on
Palomar Technologies GmbH At-A-Glance
Did you know that Palomar Technologies has thousands of systems installed worldwide and serviced directly by Palomar? Take a look into our ...
Posted by Janine Powell on
Optoelectronics Drive Advanced Packaging
Palomar Technologies has exhibited at two large Optoelectronic Technical Conferences in the last 2 months. SPIE Photonics West was held in ...
Posted by Janine Powell on
SST at SEMICON China
SST Vacuum Reflow Systems recently exhibited its systems and services at SEMICON China in Shanghai.At the show, we introduced a new ...
Posted by Julia Picarelli on
Vacuum vs. Mechanical Clamping: Which is Best?
Whether you are placing components for die attach or creating wire bonds (ball or wedge), a good quality connection requires that the ...
Posted by Janine Powell on
Low or High Production Volumes with Assembly Services or Fabrinet
Palomar has successfully worked with the global contract manufacturer Fabrinet over the last several years, working with our mutual ...
Posted by Janine Powell on
Vacuum Reflow System Basic Processing Techniques
Typical applications for the family of SST Vacuum Reflow Systems are: Package Assembly, Lid Attach, Die Attach, Glass to Metal Seals, and ...
Posted by Julia Picarelli on
Why the Materials You Choose Make a Difference in Void-Free Die Attach
SST Vacuum Reflow Systems designs and builds systems and processes that achieve low to void-free seals for die attach component parts. ...
Posted by Katie Finney on
Why Upgrade from a 2200 to a SST 3130? From an Operator’s Perspective
In August last year, we discussed the life cycle cost savings that can be enjoyed by upgrading from old DAP 2200 series soldering furnaces. ...
Posted by Julia Picarelli on
Why Process Development is Critical to Effective and Profitable Use of your Vacuum Reflow System
SST Vacuum Reflow Systems offers customers far more than just high performance vacuum/pressure soldering systems. When acquiring a system, ...
Posted by Julia Picarelli on
Fluxless Formic Acid Technology to Reduce Metal Oxides (无助焊剂甲酸技术来减少金属氧化物)
[For the English version, click here.] 液体助焊剂 （酸性底或无机底）传统上的主要用途是使氧化的金属表面产生高质量的焊料润, 导致金属零件之间更有效的焊接。然而，使用助焊剂同时也对焊接造成重大的缺陷。 缺陷#1︰ ...
Posted by Janine Powell on
SST Annual System Maintenance Recommendations
You’ve made an investment in your SST Vacuum Reflow System and want to keep it producing at a high level. To ensure systems operate at peak ...
Posted by Julia Picarelli on
Where is the Future of the Semiconductor Industry Headed?
The semiconductor industry saw the highest-ever annual sales in 2016, totaling $338.9 billion, according to the Semiconductor Industry ...
Posted by Janine Powell on
Manual Part Presentation for Gold Ball Bond/Bump
There are many different directions to go in when it comes to part presentation stages—from that simple part built by the thousands yearly, ...
Posted by Janine Powell on
Investing in an SST Strategic Service Plan
After investing in a sophisticated and complex piece of capital equipment, you expect to maximize its performance and minimize life-cycle ...
Posted by Julia Picarelli on
Selecting the Right Solder Alloy for Your Application
Selecting the right solder alloy for your application is crucial to the success of the project. If the right solder alloy is not selected ...
Posted by Janine Powell on
Gold Wire Bonding and the Rise of Copper Wire (Le Câblage en Fil d’or et l’émergence du Fil de Cuivre (Cu))
[Read the English version of the blog here.] Bien que la tendance évolue défavorablement envers le fil d’or dans le câblage de grande ...
Posted by Janine Powell on
Fluxless Formic Acid Technology to Reduce Metal Oxides
Liquid flux (acidic base or inorganic based) has traditionally been the primary solution to allow soldering of metal parts with surface ...
Posted by Janine Powell on
Custom Tooling for Wire Bonding
Wire bonding is a well-known process that has been around for many decades. It was all performed manually from the mid-1950s to the late ...
Posted by Janine Powell on
Happy New Year!
To say that 2016 has been an interesting year is probably an understatement for most of us in the electronics business. The pace of change ...
Posted by Julia Picarelli on
Happy New Year from Palomar Technologies' CEO!
Again, there is much to be thankful for as we close out 2016. Certainly microelectronics remains one of the key components of our world ...
Posted by Janine Powell on
Two Processes for Eutectic Die Bonding
Assembly Services has two separate processes available for eutectic bonding available in our lab. We can utilize our 3880 or 6500 Die ...
Posted by Janine Powell on
Improved Thermocouple Contact in Graphite Boat (改善3130型号热电偶在石墨舟的接触)
[Read the English version of the blog here.] SST Vacuum Reflow Systems ...
Posted by Janine Powell on
New Automated Production Lines and Expanded Service
As you know, the microelectronics industry is always growing and changing. We grow and change along with it, staying ahead of the next ...
Posted by Janine Powell on
Why Gold-Tin is the Best Solder Alloy
There are literally hundreds of solder alloys available from very low melting points from 38°C to extremely high brazing melting points to ...
Posted by Janine Powell on
Die Bonding: It’s All in the Family
In March 2015, Palomar Technologies acquired SST International, a turnkey supplier of vacuum and pressure furnaces for soldering, brazing, ...
Posted by Janine Powell on
Supplying the Multi-tool of Processes
Due to the accuracy and flexibility of our systems (along with the decades of experience and knowledge of our staff), we often get to work ...
Posted by Janine Powell on
Why Do We Utilize Microsoft Windows Software?
All of Palomar Technologies’ robotic bonding systems utilize Microsoft® Windows® as the core operating system. Windows has been used on our ...
Posted by Janine Powell on
Benefits and Challenges of Eutectic vs. Epoxy for Die Attach: Russian Translation (Преимущества и недостатки эвтектического микромонтажа по ...
[For the English version, click here] Данные виды монтажа очень сильно различаются. В каждом из типов имеются свои технические нюансы. ...
Posted by Katie Finney on
Ball Bonding and the Electronic Flame-Off Process
Ball bonding starts with a gold ball on the end of a very fine wire and must be very consistent in it's Free-Air Ball (FAB) size. This is ...
Posted by Katie Finney on
SST "QuikCool™" Auxiliary Cooling System
Previous blogs have detailed the value of using graphite elements and tooling for precise temperature control, wide temperature ranges, and ...
Posted by Julia Picarelli on
In Need of Prototyping, Process Development, or Contract Manufacturing Assistance?
Although the Palomar Technologies Assembly Services™ group has been around for more than 8 years we often get asked if we know somebody ...
Posted by Janine Powell on
Benefits and Challenges of Eutectic vs. Epoxy for Die Attach
The differences between eutectic and epoxy die attach are many. There are some obvious trade-offs and benefits to both, most of which ...
Posted by Janine Powell on
Wire Threading and Wedge Tool Change on a Wedge Bonder
Wedge bonding can be a great solution for performing low profile or fine pitch interconnects and is also well suited for running stitch ...
Posted by Janine Powell on
The Effects of Dimension Schemes on Component Locations: Part 2
SST designs tooling to precisely locate solderable components to our customer’s requirements. The methodology that the package designer ...
Posted by Julia Picarelli on
Glass to Metal Sealing Technology (玻璃与金属密封技术)
[For the English version of this blog, click here.] ...
Posted by Janine Powell on
Improving Software and User Interfaces
The advancements in user interfaces of devices from cell phones to automobiles seem to increase in terms of capabilities on a daily basis. ...
Posted by Janine Powell on
Achieving Higher Performance Levels with an Up-to-Date System
It seems that we upgrade phones, software, and computers every couple of years to take advantage of the latest and most reliable technology ...
Posted by Julia Picarelli on
Geometric Pattern Matching Technology for Die and Wire Bond
Have your engineers ever encountered challenges with locating parts while working with a die or wire bond application? This can be a ...
Posted by Janine Powell on
A Unified Solution for Microelectronics Packaging
With over 30 years in the business, Palomar Technologies and Royce Instruments both have a rich history of microelectronics equipment ...
Posted by Janine Powell on
High-Precision Eutectic Die Attach Process
Hybrid components and high-power communication devices are classified as high-performance and high-capacity die attach applications. These ...
Posted by Janine Powell on
SEMICON West 2016 Was Another Great Success
SEMICON West 2016 in San Francisco, CA was a great success! In the Palomar Technologies booth, we had live demonstrations of our 9000 Wedge ...
Posted by Katie Finney on
QuikCool™ Rate Profile Achieves Lower Void
The QuikCool rate profile achieves lower void concentration versus normal rate profile in AuSn solder alloys. AuSn is the “best” alloy to ...
Posted by Julia Picarelli on
Ball Bonding vs. Wedge Bonding: Russian translation (Разварка золотым шариком и клиновая ультразвуковая микросварка. Сравнение.)
[For the English version, click here.] В течение многих лет разварка проволочных перемычек является самым надежным и широко используемым ...
Posted by Janine Powell on
Inside One of the Largest Domestic Technical Conferences: SEMICON West
With more than 700 exhibitors and more than 26,000 participants, SEMICON West is one of the largest technical conferences that Palomar ...
Posted by Janine Powell on
Gold Ball Bumping Factors and Benefits
In wire bonding, a gold ball is forced down and thermosonically bonded to a die-bond pad forming the first connection of an integrated ...
Posted by Janine Powell on
Highlights from the Conference on Lasers and Electro-Optics
The Conference on Lasers and Electro-Optics (CLEO) 2016 was the last of the “big three” photonics shows in the US (Photonics West, OFC, and ...
Posted by Janine Powell on
Methods of Testing Device Hermeticity: Part 3
In part three of this series we will continue looking at the various methods for determining the leak rate of microelectronic devices with ...
Posted by Julia Picarelli on
Considering an Automated Production Line?
A production line consists of multiple distinct pieces of equipment linked together to provide distinct processes of your overall part ...
Posted by Janine Powell on
Simultaneous Soldering of Components
SST International has been a leader in the design and development of the innovative graphite tooling fixtures for the most complex eutectic ...
Posted by Julia Picarelli on
The Importance of DC Self-Bias Voltage in Plasma Applications
In reactive ion etching (RIE) plasma processes, the parameter known as DC self-bias voltage is an important “control knob” for the ion ...
Posted by Janine Powell on
How to Lower Moisture Levels in Microelectronic Components
Moisture on microelectronic components has a history of failure-inducing effects. These include electrical leakage, corrosion of metal ...
Posted by Janine Powell on
The Effect of Size Tolerances on Component Locations: Part 1
Designers of electronic packages require that their components be located very precisely; however, sometimes the positional tolerance of ...
Posted by Julia Picarelli on
The Growing RF and Microwave Industries – Packaging Challenges and Solutions
Do you happen to know someone who does not own some type of wireless device? It is becoming rarer today to meet someone who does not. ...
Posted by Janine Powell on
Chinese translation: Die Attach with a Weight or Without a Weight. What’s the Difference?
[For the English version, click here.] Palomar 公司SST 国际推荐，设计，并制作有加上重量, ...
Posted by Janine Powell on
Manual to Automatic – Compensating for Process Variables
We have the privilege and opportunity to work with customers who are ready to make the leap from a manual production environment to a fully ...
Posted by Janine Powell on
Technologies de Bobine de Haut-Parleur pour le Contrôle de tête de Câblage Filaire (Voice Coil Technology for Driving Wire Bond Heads)
[For the English translation, click here.] Les machines de câblage de Palomar Technologies utilisent depuis plusieurs années la technologie ...
Posted by Janine Powell on
How Does the Right Preform Size Design Affect Yield?
Having the right preform size affects yield in a big way. Preform suppliers offer custom size preforms, and with existing in-house tooling ...
Posted by Julia Picarelli on
Wedge Bond Process Optimization
In general, there are two main types of ultrasonic wire bonding: ball bonding and wedge bonding. Although thermosonic gold ball bonding is ...
Posted by Janine Powell on
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