Development of complex technologies continues to grow at a rapid pace, challenging existing technology giants and start-ups alike to keep pace with the growing demands for higher data capacity, faster speed, smaller designs and more sustainable solutions that are the foundation of the connected world. With today’s rapidly changing technology, time-to-market is one of the most important factors for product success.
With over 40 years of experience in the industry assembling microelectronic and photonic chip packages, Palomar Technologies Innovation Centers are full-service advanced packaging laboratories offering solutions for process development/optimization, package prototyping, die attach, wire bonding, outsourced package assembly, test, and measurement.
Innovation Center applications engineers develop your process in-house or devise a Research & Development partnership. Our goal is to get your new product accepted in the market and prepare it for high volume production.
Optoelectronics / Photonics - Lens attach, Lasers (VCSEL, EEL, EML, LED), TIA and Driver, Silicon Photonics, LIDAR, Optical Sensors, Distributed Acoustic Sensing, Printheads, TOSA / ROSA, Passive Alignment, Active Optical Cables, MOEMS, Infrared Imaging, Microbolometers, 3D Sensing
Bio-Medical – Optical Coherent Tomography, Implantable Devices (Pacemakers, Hearing Aids, etc.), Blood Oxygen Analyzers, Genomics, MEMS
Aerospace and Defense - RF Microwave modules, Avionic Control Systems, Flight Hardware, Missile Guidance, High-Reliability MEMS
Automotive - Pressure Sensors, Accelerometers, Gyroscopes, MEMS, Power Modules (IGBT, GaN on SiC)
Telecom - Multi-Channel Communications, RF Wireless Power Amplifiers (RF LDMOS, RF GaN)
We shorten time-to-market for the process development phase of your new product introduction by tapping into Palomar’s 40 years of precision die attach and wire bond process experience and expertise. Automated assembly machines are only part of the total solution—a well-developed and stable process that uses readily available automated machines for ultra-high accuracy component placement attach and wire bonding is critical to long-term success.
Our Innovation Centers will help you become the leader in your market. We’ll do this by providing state-of-the art assembly services that are capable of ultra-high precision die attach (epoxy, eutectic, flip chip, thermo-compression, void free vacuum reflow, wafer, deep access); wire bonding (gold wire ball bond, ball bumping, deep access, gold and aluminum wedge bonding, ribbon bonding); and die sorting.
Palomar Innovation Centers enable you to simultaneously deliver tangible working products to your customers—this is how we shorten your time-to-market. No large investment of capital equipment until your product is proven in the market. The capability to run “mini-production” at Palomar gives you maximum flexibility coupled with future plans for high-volume production. At any time, production can be seamlessly transferred to your own facility or to a high-volume outsource partner.
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