About

Palomar® Technologies is a leading supplier of automated microelectronic assembly machines and contract assembly services with specialization in precision die attach, wire bonding and vacuum reflow solutions. We are proudly an independent USA-based company, owned and operated by local management.

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Overview

Products

Palomar Die Bonders

Palomar Wire & Wedge Bonders

SST Vacuum Reflow Systems

SST High Vacuum Furnaces

Die Bond Features

Wire Bond Features

Vacuum Reflow Features

Applications

Palomar® Technologies provides interconnect solutions for a wide variety of industries and applications. With 45+ years supporting the semiconductor and photonics industries, we have expanded across automotive (LiDAR & power modules), medical, microwave, RF/wireless, Datacom, telecom and a few niche markets.

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Overview

Processes

Die Bonding

Wire Bonding

Vacuum Reflow

Innovation Centers

Palomar® Technologies Innovation Centers are full-service advanced packaging laboratories offering solutions for process development, package prototyping, die attach, wire bonding, vacuum reflow, outsourced package assembly, test, and measurement.

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Overview

Resources

Get access to our entire knowledge database: read blog articles and download materials.

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Overview

Contact Us

Contact Palomar® Technologies for more information about our Total Process Solution including Palomar die bonders, Palomar wire and wedge bonders, SST vacuum reflow systems, along with Innovation Centers for outsourced manufacturing and assembly.

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Overview

INNOVATION CENTERS

 

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Development of complex technologies continues to grow at a rapid pace, challenging existing technology giants and start-ups alike to keep pace with the growing demands for higher data capacity, faster speed, smaller designs and more sustainable solutions that are the foundation of the connected world. With today’s rapidly changing technology, time-to-market is one of the most important factors for product success.

With over 40 years of experience in the industry assembling microelectronic and photonic chip packages, Palomar Technologies Innovation Centers are full-service advanced packaging laboratories offering solutions for process development/optimization, package prototyping, die attach, wire bonding, outsourced package assembly, test, and measurement.  

Innovation Center applications engineers develop your process in-house or devise a Research & Development partnership. Our goal is to get your new product accepted in the market and prepare it for high volume production.

Some of Our Applications Experience

Optoelectronics / Photonics  -  Lens attach, Lasers (VCSEL, EEL, EML, LED), TIA and Driver, Silicon Photonics, LIDAR, Optical Sensors, Distributed Acoustic Sensing, Printheads, TOSA / ROSA, Passive Alignment, Active Optical Cables, MOEMS, Infrared Imaging, Microbolometers, 3D Sensing

Bio-Medical – Optical Coherent Tomography, Implantable Devices (Pacemakers, Hearing Aids, etc.), Blood Oxygen Analyzers, Genomics, MEMS

Aerospace and Defense - RF Microwave modules, Avionic Control Systems, Flight Hardware, Missile Guidance, High-Reliability MEMS

Automotive - Pressure Sensors, Accelerometers, Gyroscopes, MEMS, Power Modules (IGBT, GaN on SiC)

Telecom - Multi-Channel Communications, RF Wireless Power Amplifiers (RF LDMOS, RF GaN)
green laser
engineers at 3880

Expert Process Development

We shorten time-to-market for the process development phase of your new product introduction by tapping into Palomar’s 40 years of precision die attach and wire bond process experience and expertise. Automated assembly machines are only part of the total solution—a well-developed and stable process that uses readily available automated machines for ultra-high accuracy component placement attach and wire bonding is critical to long-term success.

Solutions

Our Innovation Centers will help you become the leader in your market. We’ll do this by providing state-of-the art assembly services that are capable of ultra-high precision die attach (epoxy, eutectic, flip chip, thermo-compression, void free vacuum reflow, wafer, deep access); wire bonding (gold wire ball bond, ball bumping, deep access, gold and aluminum wedge bonding, ribbon bonding); and die sorting.
stacked die
Innovation Center Lab - USA

Low to Medium Volume Production

Palomar Innovation Centers enable you to simultaneously deliver tangible working products to your customers—this is how we shorten your time-to-market. No large investment of capital equipment until your product is proven in the market. The capability to run “mini-production” at Palomar gives you maximum flexibility coupled with future plans for high-volume production. At any time, production can be seamlessly transferred to your own facility or to a high-volume outsource partner.