Together, we’ll help you become the leader in your market by providing state-of-the-art assembly services that are capable of ultra-high precision Die Attach (Eutectic, Epoxy, Ag Sinter, UV, Flip Chip & Vacuum Reflow).
Coming soon to Palomar’s Demo Facility @ Epic UK… Ball Bonding, Bumping and Coining, Wedge & Ribbon Bonding, Die Sorting and TAB Bonding. Our partners at EPIC will also add to their capabilities in line with customer feedback and requirements. Please tell us what you need.
Ongoing, we will collaborate with EPIC, Key Customers, and Partners to release Technical Research Papers, aimed at current and future photonic packaging challenges. We want to align our R&D Roadmap at Palomar to overcome these challenges and provide tailored optimized solutions for our customers going forward.
Our laboratory offers:
- Experienced engineering, purchasing and technical staff
- Cost-effective alternative to investing in capital equipment
- Prototyping devices and manufacturing methods quickly and efficiently evaluated
- Dry lab space with ESD flooring, air locked and secure 24/7 access
- Controlled heating and cooling systems
- ISO Class 6 & 7 (Fed STD Class 1,000 - 10,000) cleanroom
- Secure material storage
- Strict IP confidentiality