Palomar® Technologies is a leading supplier of automated microelectronic assembly machines and contract assembly services with specialization in precision die attach, wire bonding and vacuum reflow solutions. We are proudly an independent USA-based company, owned and operated by local management.

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Palomar® Technologies provides interconnect solutions for a wide variety of industries and applications. With 45+ years supporting the semiconductor and photonics industries, we have expanded across automotive (LiDAR & power modules), medical, microwave, RF/wireless, Datacom, telecom and a few niche markets.

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Innovation Centers

Palomar® Technologies Innovation Centers are full-service advanced packaging laboratories offering solutions for process development, package prototyping, die attach, wire bonding, vacuum reflow, outsourced package assembly, test, and measurement.

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Get access to our entire knowledge database: read blog articles and download materials.

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Contact Us

Contact us for more info about our Total Process Solution including die bonders, wire and wedge bonders, SST vacuum reflow systems, and Innovation Centers.

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Serving European Customers’ Photonics & Microelectronics Needs

Palomar’s Demonstration/Prototyping Lab is strategically located within the new Electronics and Photonics Innovation Center (EPIC) in Paignton (Torbay), the heart of a vibrant electronics and photonics cluster in the United Kingdom. EPIC is a center of excellence, supporting technological innovation and promoting collaborative activity between businesses and research institutions. It focuses on supporting start-up and spin-off companies in the microelectronics and photonics sector.

The Palomar Demonstration Laboratory gives companies in the European Photonics Market the opportunity to learn more about Palomar’s state-of-the-art techniques driving the photonics market, and to take advantage of prototyping and process development services utilizing Palomar’s decades of experience in the photonics market.

Our highly skilled in-house engineering staff and technicians remain close to Palomar Technologies design and manufacturing engineers, providing a close feedback loop which maximizes our equipment to provide an optimized solution for your product assembly process. This maximizes first pass yield and minimizes scrap, insuring you get the best performance from your product and process.


Together, we’ll help you become the leader in your market by providing state-of-the-art assembly services that are capable of ultra-high precision Die Attach (Eutectic, Epoxy, Ag Sinter, UV, Flip Chip & Vacuum Reflow).

Coming soon to Palomar’s Demo Facility @ Epic UK… Ball Bonding, Bumping and Coining, Wedge & Ribbon Bonding, Die Sorting and TAB Bonding. Our partners at EPIC will also add to their capabilities in line with customer feedback and requirements. Please tell us what you need.

Ongoing, we will collaborate with EPIC, Key Customers, and Partners to release Technical Research Papers, aimed at current and future photonic packaging challenges. We want to align our R&D Roadmap at Palomar to overcome these challenges and provide tailored optimized solutions for our customers going forward.

Our laboratory offers:

  • Experienced engineering, purchasing and technical staff
  • Cost-effective alternative to investing in capital equipment
  • Prototyping devices and manufacturing methods quickly and efficiently evaluated
  • Dry lab space with ESD flooring, air locked and secure 24/7 access
  • Controlled heating and cooling systems
  • ISO Class 6 & 7 (Fed STD Class 1,000 - 10,000) cleanroom
  • Secure material storage
  • Strict IP confidentiality

Die Attach

Machines used: Palomar 3880-II Die Bonder as well as access to an SST 5100 Vacuum Pressure Furnace

Wire Bonding

Machines used: Palomar 8100 Wire Bonder, Palomar 9000 Wedge Bonder

Additional Capabilities

  • Hermetic Package Sealing
  • High Vacuum MEMS Packaging
  • Die Sorting
  • Wire Pull Testing
  • Die/Shear Testing
  • Plasma Cleaning: single gas, multiple gas, argon, oxygen, forming gas
  • Encapsulation
  • Dam & Fill
  • Glob Top
  • Video Measurement
  • Scanning Electron Microscope 

*Consigned test equipment floor space for special applications available

For information about booking a demonstration, please contact:


Martyn Davies
UK & Ireland Business Development Manager

Palomar UK Demo Facility │ EPIC Electronics & Photonics Innovation Centre | White Rock Business Park │ Waddeton Close | Paignton | Devon │ UK │ TQ4 7RZ

Mobile: +44 7904 208374

Email: mdavies@bonders.com


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Data Sheet White@2x.png 3880-II Die Bonder
Data Sheet White@2x.png Technical Papers & eBooks
Data Sheet White@2x.png 8100 Wire Bonder
Data Sheet White@2x.png Process Development Services