PTI Blog

Aerospace and Defense Competitive Strategies
Aerospace and Defense Competitive Strategies for the 2020s
In the same way that iron, steam, and the telegraph marked a mega-shift in travel and military technologies for the mid-Victorian era, new superpowers, photonics, and AI will radically reshape aerospace and defense by the mid-twenty-first century.
Posted by Palomar Technologies MarCom Team on Wed, Jul 01, 2020 @ 03:00 PM
Pressure-less Silver Sintering for RF Power Electronics, Part 4 of 4 (应用于射频功率器件的无压银烧结技术，第4篇，共4篇)
[For the English version of this blog, please click here.] 本系列的先前几篇文章着重介绍了射频功率器件封装业在从全球制造无铅化开始的发展趋势中，一些不容忽视的动态。紧跟其后的是满足生态能耗的需要（效率和可持续性），解决制造业成本和竞争压力所需的工程设计和工艺挑战，最终，更广泛地推动技术并带动需求。 作为这些挑战孕育的成果,
Posted by Palomar Technologies MarCom Team on Wed, Jun 17, 2020 @ 03:00 PM
Pressure-less Silver Sintering for RF Power Electronics, Part 3 of 4 (应用于射频功率器件的无压银烧结技术，第3篇，共4篇)
[For the English version of this blog, please click here.] 在本系列的第3篇日志中，我们将介绍在喷射点胶应用的研究成果。正如我们之前在本日志系列的第2篇中所解释的，经过Palomar开发的Fixed BLT软件管控后才能得到最佳效果的保障。首先，让我们看一下喷射点胶与其他工艺方法的优势对比：
Posted by Palomar Technologies MarCom Team on Wed, Jun 10, 2020 @ 03:00 PM
Pressure-less Silver Sintering for RF Power Electronics
Pressure-less Silver Sintering for RF Power Electronics, Part 2 of 4  (应用于射频功率器件的无压银烧结技术，第2篇，共4篇)
[For the English version of this blog, please click here.] 在此第二篇关于无压银烧结的日志中，我们将详细介绍在新加坡创新实验中心完成的各项研究，旨在将银作为一种有效的无铅焊料，并与黄金同样可行的替代品。在本系列的第1篇中，我们列举了一系列的因素，以确定银焊料在价格、物理性能和应用范围方面的优势。在这里，我们将着重介绍实际应用及其开发的细节。在设备方面，我们使用了Palomar
Posted by Palomar Technologies MarCom Team on Wed, Jun 03, 2020 @ 03:00 PM
COVID-19 and the Pre-existing Trends in Aerospace - Part 2
Our first blog examined the potential importance of three new technologies on the aerospace market over the next half-decade. These were chosen for both their importance within the sector, but also as being highly representative of other
Posted by Palomar Technologies MarCom Team on Wed, May 27, 2020 @ 03:00 PM
Pressure-less Silver Sintering for RF Power Electronics
Pressure-less Silver Sintering for RF Power Electronics, Part 1 of 4 (应用于射频功率器件的无压银烧结技术，第1篇，共4篇)
[For the English version of this blog, please click here.] 银烧结技术从20世纪80年代就出现了，但这一工艺却面临着诸多问题。传统烧结的局限性、快速增长的市场需求、5G、不断发展的技术、能源和环境生态可持续性问题以及无铅要求，使包括Palomar Technologies在内的许多公司重新审视这些挑战。在我们的案例中，会着重介绍在高温环境下无压烧结的应用，例如在射频功率器件微组装时的应用。
Posted by Palomar Technologies MarCom Team on Mon, May 25, 2020 @ 03:00 PM
Lid Sealing versus Seam Sealing
While lid sealing has been around for many years and is considered a legacy technology, it is helpful to revisit the topic and consider how lid sealing compares to seam sealing. By understanding the technology and its typical uses and within the
Posted by Palomar Technologies MarCom Team on Wed, May 20, 2020 @ 03:00 PM
COVID-19 and the Pre-existing Trends in Aerospace - Part 1
Before the COVID-19 pandemic, passenger numbers had been expected to double over the next 15 years, meaning significant growth in aerospace demand. Current estimates downgrade this by at least 25 percent. The need for 38,000 new aircraft with a
Posted by Palomar Technologies MarCom Team on Wed, May 13, 2020 @ 03:00 PM
Hybond
HYBOND, Inc., a Palomar Technology Partner, Introduces the DFS-IV Universal Wire Bonder Test Unit Product Line
HYBOND’S DFS-IV is a lightweight, compact, hand portable touch screen instrument for measuring force, ultrasonics generator board output (U/S) and time parameters on manual, semiautomatic and automatic wire bonders that bond fine wires and ribbons.
Posted by Palomar Technologies MarCom Team on Mon, May 04, 2020 @ 03:00 PM
Combining Bonder and Vacuum Reflow Technologies
Combining Bonder and Vacuum Reflow Technologies for High-Reliability Packaging – Case #2 Optical Transceivers
In our last blog on combining bonder and vacuum reflow technologies, we presented a case for how to combine these technologies to manufacture successfully high-reliability LED packaging. In this blog, we present another example of semiconductor
Posted by Palomar Technologies MarCom Team on Wed, Apr 29, 2020 @ 03:00 PM

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