PTI Blog

Typical power module construction
Delivering Higher Reliability, Higher Quality Power Modules
Power Semiconductors have enjoyed steady growth for at least the last 15 years, with only the occasional down turn. It is expected that the global market will continue to drive more energy consumption (roughly 20TWh is currently used today).
Posted by Palomar Technologies MarCom Team on Tue, May 07, 2019 @ 02:03 PM
LiDAR
Creating the Cost Competitive LiDAR Solution for Mass Autonomous Vehicle Rollout
There is a multi-trillion-dollar market developing around the world through the adoption of disruptive technology in driverless vehicles. This is the consensus of a number of early 2019 commentaries[i] on the growth prospects for the autonomous
Posted by Palomar Technologies MarCom Team on Tue, Mar 26, 2019 @ 11:02 PM
desert
Bridging the Valley of Death: Meeting Advanced Microelectronic and Photonic Packaging Needs
Over the past several years, R&D spending, innovation, and invention has increased in Asia as these economies become more developed and their technology prowess more sophisticated. Today, there is substantial demand for advanced photonics packaging
Posted by Palomar Technologies MarCom Team on Wed, Feb 20, 2019 @ 04:12 PM
smart cities
Photonics Lights the Way for Smart Cities Around the World
Today, Singapore, London and Dubai lead the world when it comes to powering a world-class smart nationi, bypassing tech-savvy capitals like New York, Paris and Beijing. Singapore has been consistent in its efforts to deploy disruptive technologies
Posted by Palomar Technologies MarCom Team on Fri, Feb 01, 2019 @ 04:00 PM
zeger3500_cutout
Product Discontinuation Program for Palomar 2460, 2470 and 3500 Bonders
Palomar Technologies has a long history of serving the microelectronics and photonics markets and has provided high quality equipment and services to our customers for more than 20 years. As the industry advances, so do Palomar bonders as we strive
Posted by Palomar Technologies MarCom Team on Wed, Jan 30, 2019 @ 03:06 PM
gold planar bumps blog
Finding the Right Solution to Achieve Gold Planar Bumps for Flip Chip Bonding with Challenging Specifications
The semiconductor packaging industry continues a relentless pursuit to make smaller packages with higher throughput. The industry demand for smaller components requires manufacturers to adapt by developing new processes. Achieving consistent,
Posted by Palomar Technologies MarCom Team on Thu, Jan 17, 2019 @ 03:27 PM
Happy New Year
Happy New Year from Palomar Technologies' CEO and President
As we finish another record year at Palomar Technologies, we remain grateful for the collaborative relationships we enjoy with our customers. Working together, we have created and delivered solutions that drive forward the rapid changes in the ever
Posted by Bruce W. Hueners on Mon, Dec 31, 2018 @ 01:31 PM
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A Note From the President of SST Vacuum Reflow Systems
As we look forward to 2019, I’d like to take a moment to reflect on SST’s achievements in 2018, and to thank our customers, with whom we collaborate closely, and the SST team who make it all possible. 2018 marked the 40th anniversary for SST Vacuum
Posted by Anthony J. Wilson on Fri, Dec 28, 2018 @ 01:11 PM
Using Outsourced Manufacturing and Assembly for Advanced Photonic/Optoelectronic Chip Packages
Find out more about what Palomar Technologies Assembly Services™ has to offer, or contact us for more details.   ---- Nick Evans Applications Engineer Palomar Technologies, Inc.
Posted by Palomar Technologies MarCom Team on Wed, Oct 24, 2018 @ 03:08 PM
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Keys to Maximizing Bonder Productivity
Can your manufacturing facility afford to lose $100,000 an hour to machine downtime? According to Information Technology Intelligence Consulting, 98% of all organizations with over 1,000 employees report that a single hour of downtime costs their
Posted by Palomar Technologies MarCom Team on Wed, Sep 26, 2018 @ 03:03 PM

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