About

Palomar® Technologies is a leading supplier of automated microelectronic assembly machines and contract assembly services with specialization in precision die attach, wire bonding and vacuum reflow solutions. We are proudly an independent USA-based company, owned and operated by local management.

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Overview

Products

Palomar Die Bonders

Palomar Wire & Wedge Bonders

SST Vacuum Reflow Systems

SST High Vacuum Furnaces

Die Bond Features

Wire Bond Features

Vacuum Reflow Features

Applications

Palomar® Technologies provides interconnect solutions for a wide variety of industries and applications. With 45+ years supporting the semiconductor and photonics industries, we have expanded across automotive (LiDAR & power modules), medical, microwave, RF/wireless, Datacom, telecom and a few niche markets.

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Overview

Processes

Die Bonding

Wire Bonding

Vacuum Reflow

Innovation Centers

Palomar® Technologies Innovation Centers are full-service advanced packaging laboratories offering solutions for process development, package prototyping, die attach, wire bonding, vacuum reflow, outsourced package assembly, test, and measurement.

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Overview

Resources

Get access to our entire knowledge database: read blog articles and download materials.

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Overview

Contact Us

Contact Palomar® Technologies for more information about our Total Process Solution including Palomar die bonders, Palomar wire and wedge bonders, SST vacuum reflow systems, along with Innovation Centers for outsourced manufacturing and assembly.

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Overview

PTI Blog

The Resurgence of Brand Value
In the early part of 2021, global analysts McKinsey & Company published a number of articles noting that the COVID crisis has led, among other things, to a resurgence in consumer preference for premium brand goods, together with positive
Posted by Palomar Technologies MarCom Team on Mon, Apr 12, 2021 @ 03:00 PM
Packaging technologies meet quantum opportunities
Packaging Technologies Meet Quantum Opportunities
This is the first in a 3-part blog series exploring the world of quantum technologies and its impact on semiconductor packaging. With the rapid advance of digitization, the world is becoming more and more dependent upon the secure communication of
Posted by Palomar Technologies MarCom Team on Mon, Mar 29, 2021 @ 03:00 PM
Die Bond Flexibility for Next Generation Photonics Packaging
Much of the semiconductor packaging industry is engaged with an exciting and growing photonics ecosystem. Anticipating seven percent CAGR over the next five years, this clearly outpaces most other manufacturing sectors. That having been said, the
Posted by Palomar Technologies MarCom Team on Mon, Mar 15, 2021 @ 03:00 PM
v-bond wires
Improve Wire Bond Capability and Reliability Through Use of Auxiliary Wires
Auxiliary wires are commonly defined as an additional wire outside of a normal ball-to-stitch wire bond. Whether it be a pre-wire, generally referred to as stand-off stitch, or a post-wire, also known as a security bump, Palomar offers several
Posted by Palomar Technologies MarCom Team on Mon, Mar 01, 2021 @ 04:00 PM
Interoperability Across Security, and Defense Ecosystems
“Necessity”, quips the proverb, “is the mother of invention.” Put colloquially, if you are desperate enough to attain a particular goal, you will find a way of achieving it. This is true, individually and collectively, as it is of internal or
Posted by Palomar Technologies MarCom Team on Mon, Feb 15, 2021 @ 04:00 PM
Aerospace and Defense: 2021 and Beyond, Part 2
“New space technologies … will bring about fundamental change that will influence business and our personal lives.” George Whitesides, Virgin Galactic. In the first part of our A&D assessment for 2021, the reader’s thoughts were taken mid-decade,
Posted by Palomar Technologies MarCom Team on Mon, Feb 01, 2021 @ 04:00 PM
Aerospace and Defense: 2021 and Beyond
As global COVID-19 management enters a particularly challenging race between deepening health crises and the efficacy of vaccination, all sectors of the global economy remain negatively impacted, though not all equally. Significant variances exist
Posted by Palomar Technologies MarCom Team on Mon, Jan 18, 2021 @ 04:00 PM
2020 in Retrospect. What's in store for 2021?
As we reflect on the events of 2020 and anticipate their unfolding in 2021, our vision sharpens to reveal a clear trifecta of forces affecting the semiconductor ecosystem, rapid change, foundational stabilities, and the discernible direction we are
Posted by Palomar Technologies MarCom Team on Mon, Jan 04, 2021 @ 06:15 PM
Happy Holidays from Palomar Technologies
Looking forward to 2021 – Building upon the strengths and learnings of 2020
The year of 2020 will no doubt go down in history as one of the most difficult, life-changing years of the past century. At the beginning of 2020, no one could have anticipated the global impact that COVID-19 would have on all of us and in
Posted by Palomar Technologies MarCom Team on Tue, Dec 22, 2020 @ 04:32 PM
GaN
Achieving less than 1% voiding in GaN die attach processing
The die bonding, or die attach process, consists of attaching a die/chip to a substrate or package. This attachment can be performed with either eutectic solder or adhesive (epoxy). SST Vacuum Reflow Systems, a Palomar solution recently published an
Posted by Palomar Technologies MarCom Team on Mon, Nov 30, 2020 @ 04:15 PM

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