Palomar® Technologies is a leading supplier of automated microelectronic assembly machines and contract assembly services with specialization in precision die attach, wire bonding and vacuum reflow solutions. We are proudly an independent USA-based company, owned and operated by local management.

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Palomar® Technologies provides interconnect solutions for a wide variety of industries and applications. With 45+ years supporting the semiconductor and photonics industries, we have expanded across automotive (LiDAR & power modules), medical, microwave, RF/wireless, Datacom, telecom and a few niche markets.

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Innovation Centers

Palomar® Technologies Innovation Centers are full-service advanced packaging laboratories offering solutions for process development, package prototyping, die attach, wire bonding, vacuum reflow, outsourced package assembly, test, and measurement.

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Contact Us

Contact Palomar® Technologies for more information about our Total Process Solution including Palomar die bonders, Palomar wire and wedge bonders, SST vacuum reflow systems, along with Innovation Centers for outsourced manufacturing and assembly.

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PTI Blog

“Necessity”, quips the proverb, “is the mother of invention.” Put colloquially, if you are desperate enough to attain a particular goal, you will find a way of achieving it. This is true, individually and collectively, as it is of internal or
Posted by Palomar Technologies MarCom Team on Mon, Feb 15, 2021 @ 04:00 PM
“New space technologies … will bring about fundamental change that will influence business and our personal lives.” George Whitesides, Virgin Galactic. In the first part of our A&D assessment for 2021, the reader’s thoughts were taken mid-decade,
Posted by Palomar Technologies MarCom Team on Mon, Feb 01, 2021 @ 04:00 PM
As global COVID-19 management enters a particularly challenging race between deepening health crises and the efficacy of vaccination, all sectors of the global economy remain negatively impacted, though not all equally. Significant variances exist
Posted by Palomar Technologies MarCom Team on Mon, Jan 18, 2021 @ 04:00 PM
As we reflect on the events of 2020 and anticipate their unfolding in 2021, our vision sharpens to reveal a clear trifecta of forces affecting the semiconductor ecosystem, rapid change, foundational stabilities, and the discernible direction we are
Posted by Palomar Technologies MarCom Team on Mon, Jan 04, 2021 @ 06:15 PM
The year of 2020 will no doubt go down in history as one of the most difficult, life-changing years of the past century. At the beginning of 2020, no one could have anticipated the global impact that COVID-19 would have on all of us and in
Posted by Palomar Technologies MarCom Team on Tue, Dec 22, 2020 @ 04:32 PM
The die bonding, or die attach process, consists of attaching a die/chip to a substrate or package. This attachment can be performed with either eutectic solder or adhesive (epoxy). SST Vacuum Reflow Systems, a Palomar solution recently published an
Posted by Palomar Technologies MarCom Team on Mon, Nov 30, 2020 @ 04:15 PM
When it comes to microelectronics and photonics packaging assembly, components such as die are placed onto packages. All automated die bonding systems require some type of vision processing for the machine to accurately locate the component before
Posted by Palomar Technologies MarCom Team on Mon, Nov 16, 2020 @ 04:00 PM
Process development can present many challenges in the die attach market when the optimal process or package design varies drastically. Specifically, the interconnect methods can include conductive epoxy, solder paste, sintered paste, eutectic
Posted by Palomar Technologies MarCom Team on Tue, Oct 27, 2020 @ 04:00 PM
Epoxy die attach, sometimes referred to as epoxy die bonding, is the most commonly used die attach method. Whether dispensed or daubed via single pin or stamp transfer, it is a more cost-effective solution compared to eutectic bonding; this is due
Posted by Palomar Technologies MarCom Team on Thu, Aug 20, 2020 @ 03:00 PM
Eutectic die attach involves bonding a chip or die to a surface using a solder alloy. These particular solder alloys are used because of their unique property of having a eutectic melting point. Eutectic melting points are much lower than the
Posted by Palomar Technologies MarCom Team on Wed, Aug 12, 2020 @ 03:00 PM