About

Palomar® Technologies is a leading supplier of automated microelectronic assembly machines and contract assembly services with specialization in precision die attach, wire bonding and vacuum reflow solutions. We are proudly an independent USA-based company, owned and operated by local management.

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Applications

Palomar® Technologies provides interconnect solutions for a wide variety of industries and applications. With 45+ years supporting the semiconductor and photonics industries, we have expanded across automotive (LiDAR & power modules), medical, microwave, RF/wireless, Datacom, telecom and a few niche markets.

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Overview


Innovation Centers

Palomar® Technologies Innovation Centers are full-service advanced packaging laboratories offering solutions for process development, package prototyping, die attach, wire bonding, vacuum reflow, outsourced package assembly, test, and measurement.

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Resources

Get access to our entire knowledge database: read blog articles and download materials.

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Contact Us

Contact Palomar® Technologies for more information about our Total Process Solution including Palomar die bonders, Palomar wire and wedge bonders, SST vacuum reflow systems, along with Innovation Centers for outsourced manufacturing and assembly.

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PTI Blog

The die bonding, or die attach process, consists of attaching a die/chip to a substrate or package. This attachment can be performed with either eutectic solder or adhesive (epoxy). SST Vacuum Reflow Systems, a Palomar solution recently published an
Posted by Palomar Technologies MarCom Team on Mon, Nov 30, 2020 @ 04:15 PM
When it comes to microelectronics and photonics packaging assembly, components such as die are placed onto packages. All automated die bonding systems require some type of vision processing for the machine to accurately locate the component before
Posted by Palomar Technologies MarCom Team on Mon, Nov 16, 2020 @ 04:00 PM
Process development can present many challenges in the die attach market when the optimal process or package design varies drastically. Specifically, the interconnect methods can include conductive epoxy, solder paste, sintered paste, eutectic
Posted by Palomar Technologies MarCom Team on Tue, Oct 27, 2020 @ 04:00 PM
Epoxy die attach, sometimes referred to as epoxy die bonding, is the most commonly used die attach method. Whether dispensed or daubed via single pin or stamp transfer, it is a more cost-effective solution compared to eutectic bonding; this is due
Posted by Palomar Technologies MarCom Team on Thu, Aug 20, 2020 @ 03:00 PM
Eutectic die attach involves bonding a chip or die to a surface using a solder alloy. These particular solder alloys are used because of their unique property of having a eutectic melting point. Eutectic melting points are much lower than the
Posted by Palomar Technologies MarCom Team on Wed, Aug 12, 2020 @ 03:00 PM
With all eyes on 2050 and the mid-century point, a highly ambitious series of global programs are in place to reduce carbon emissions simultaneously aiming to upgrade all forms of transport with their green equivalent—land, air, sea. Electric power
Posted by Palomar Technologies MarCom Team on Tue, Jul 21, 2020 @ 03:00 PM
In the same way that iron, steam, and the telegraph marked a mega-shift in travel and military technologies for the mid-Victorian era, new superpowers, photonics, and AI will radically reshape aerospace and defense by the mid-twenty-first century.
Posted by Palomar Technologies MarCom Team on Wed, Jul 01, 2020 @ 03:00 PM
[For the English version of this blog, please click here.] 本系列的先前几篇文章着重介绍了射频功率器件封装业在从全球制造无铅化开始的发展趋势中,一些不容忽视的动态。紧跟其后的是满足生态能耗的需要(效率和可持续性),解决制造业成本和竞争压力所需的工程设计和工艺挑战,最终,更广泛地推动技术并带动需求。 作为这些挑战孕育的成果,
Posted by Palomar Technologies MarCom Team on Wed, Jun 17, 2020 @ 03:00 PM
[For the English version of this blog, please click here.] 在本系列的第3篇日志中,我们将介绍在喷射点胶应用的研究成果。正如我们之前在本日志系列的第2篇中所解释的,经过Palomar开发的Fixed BLT软件管控后才能得到最佳效果的保障。首先,让我们看一下喷射点胶与其他工艺方法的优势对比:
Posted by Palomar Technologies MarCom Team on Wed, Jun 10, 2020 @ 03:00 PM
[For the English version of this blog, please click here.] 在此第二篇关于无压银烧结的日志中,我们将详细介绍在新加坡创新实验中心完成的各项研究,旨在将银作为一种有效的无铅焊料,并与黄金同样可行的替代品。在本系列的第1篇中,我们列举了一系列的因素,以确定银焊料在价格、物理性能和应用范围方面的优势。在这里,我们将着重介绍实际应用及其开发的细节。在设备方面,我们使用了Palomar
Posted by Palomar Technologies MarCom Team on Wed, Jun 03, 2020 @ 03:00 PM