About

Palomar® Technologies is a leading supplier of automated microelectronic assembly machines and contract assembly services with specialization in precision die attach, wire bonding and vacuum reflow solutions. We are proudly an independent USA-based company, owned and operated by local management.

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Applications

Palomar® Technologies provides interconnect solutions for a wide variety of industries and applications. With 45+ years supporting the semiconductor and photonics industries, we have expanded across automotive (LiDAR & power modules), medical, microwave, RF/wireless, Datacom, telecom and a few niche markets.

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Overview


Innovation Centers

Palomar® Technologies Innovation Centers are full-service advanced packaging laboratories offering solutions for process development, package prototyping, die attach, wire bonding, vacuum reflow, outsourced package assembly, test, and measurement.

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Resources

Get access to our entire knowledge database: read blog articles and download materials.

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Contact Us

Contact Palomar® Technologies for more information about our Total Process Solution including Palomar die bonders, Palomar wire and wedge bonders, SST vacuum reflow systems, along with Innovation Centers for outsourced manufacturing and assembly.

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PTI Blog

This is part 2 of a 3-part blog series on Logistic Sensor Packaging. For more information, read Part 1. As a technical discipline, robotics relates to the development, design and manufacture of machines capable of carrying out a range of automated
Posted by Palomar Technologies MarCom Team on Tue, Aug 03, 2021 @ 03:00 PM
The next few years hold out sensor opportunities concomitant to the spectacular growth in global robotics. One of the key drivers for the latter is logistics; from small to large scale, from warehouses measured by the square meter, to airports
Posted by Palomar Technologies MarCom Team on Thu, Jul 22, 2021 @ 03:00 PM
Power electronics are present in our everyday lives in many applications. High-efficiency lighting, elevators, motor converters, solar energy, welding, industrial frequency converters, pumps, and a variety of other industrial applications that
Posted by Palomar Technologies MarCom Team on Tue, Jun 29, 2021 @ 03:00 PM
When it comes to the die bonding process for the assembly of RF power transistors, the most important metric is good thermal management. Ensuring high thermal conductivity of the bond between the chips and the transistor package is paramount to the
Posted by Palomar Technologies MarCom Team on Tue, Jun 15, 2021 @ 03:00 PM
One of the great shifts currently taking place in global defense sensor technologies, is due to a fundamental realignment of military strategies, itself brought about by the convergence of a number of critical megatrends; long-term COVID-19 endemic
Posted by Palomar Technologies MarCom Team on Tue, Jun 01, 2021 @ 03:00 PM
A traditional means to justify the expense of purchasing new bonding equipment is to calculate the units per hour (UPH) of the proposed bonding system, along with the internal costs for direct and indirect labor to run the machines. When calculating
Posted by Palomar Technologies MarCom Team on Mon, May 17, 2021 @ 03:00 PM
In Part two of our series on Packaging Technologies meet Quantum Opportunities, Palomar’s Dr. Anthony O’Sullivan interviews Dr. Andrew Robertson, Research & Innovation Manager at Bay Photonics. Bay Photonics is an independent Photonics IC (PIC)
Posted by Palomar Technologies MarCom Team on Mon, Apr 26, 2021 @ 03:00 PM
In the early part of 2021, global analysts McKinsey & Company published a number of articles noting that the COVID crisis has led, among other things, to a resurgence in consumer preference for premium brand goods, together with positive
Posted by Palomar Technologies MarCom Team on Mon, Apr 12, 2021 @ 03:00 PM
This is the first in a 3-part blog series exploring the world of quantum technologies and its impact on semiconductor packaging. With the rapid advance of digitization, the world is becoming more and more dependent upon the secure communication of
Posted by Palomar Technologies MarCom Team on Mon, Mar 29, 2021 @ 03:00 PM
Much of the semiconductor packaging industry is engaged with an exciting and growing photonics ecosystem. Anticipating seven percent CAGR over the next five years, this clearly outpaces most other manufacturing sectors. That having been said, the
Posted by Palomar Technologies MarCom Team on Mon, Mar 15, 2021 @ 03:00 PM