Optoelectronic
RF/Wireless
Aerospace & Defense
Microwave
Automotive
Power Modules
Medical and Life Sciences
LEDs
Niche
8100 Wire/Ball Bonder
The newest Palomar fully automated, thermosonic high-speed, ball-and-stitch fine wire bonder capable of ball bumping and customized looping profiles. Based on Palomar’s proven wire bonder design and incorporating the latest productivity technology and operator ergonomics, making it the next generation of fine wire bonders.
Utilizes advanced geometric pattern matching technology to reliably and accurately locate parts that are randomly oriented or have greyscale variations by using a set of boundary curves that are not tied to a traditional pixel-grid. Maximizes throughput, and enables part inspection both before and after bonding.
A comprehensive and centralized data management and analysis system that provides machine and process trend monitoring, storage and traceability of data across platforms, and closed loop process control for increased yields and predictive maintenance.
Intelligent Interactive Graphical Interface® - i2Gi®
Supports advanced wire bond control through an intuitive interface that simplifies programming and provides real time graphical feedback to the user of bonding performance. Allows for a connected view with the ability to overlay 1:1 scaled graphics on top of live video of actual part.
Automated Handler System
Automated inline handlers and conveyor systems to seamlessly bring parts in and out of the workspace. Custom designed for all process to fit all components and even apply heat for bot die and wire applications. Built with integration in mind for fully automatic assembly lines that can include all of our bonders.
Vision Standardization
Automated calibration of image lighting across multiple bonders. Allows for seamless transfer of programs from bonder to bonder with zero time spent re teaching or adjusting references. Greatly reduces downtime when programs need to be updated and distributed across bonders.
Digitally Controlled NEFO Generator
Digitally controlled and displayed for precision parameter adjustments and real time process monitoring utilizing simple but comprehensive alerts. The graphical display of recent bonds facilitates effective process development.
Forecasting the 2020 Micro-Optoelectronics Business During COVID-19
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Combining Bonder and Vacuum Reflow Technologies for High-Reliability Packaging
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Rapid Deployment of Photonic Chip Packages: From Prototype to Production using Outsourced Manufacturing
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Manual Load, Island of Automation, or In-Line: What is the Right Solution for my Process?
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Ball and Wedge Bonders & Loop Mode Development
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Vacuum vs. Mechanical Clamping: Which is Best?
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