8100 Wire/Ball Bonder

The newest Palomar fully automated, thermosonic high-speed, ball-and-stitch fine wire bonder capable of ball bumping and customized looping profiles. Based on Palomar’s proven wire bonder design and incorporating the latest productivity technology and operator ergonomics, making it the next generation of fine wire bonders.

Category Palomar Wire & Wedge Bonders Processes

Ball Bumping, Gold Wire Bonding

Applications
  • Large complex hybrids 
  • HB/HP LED arrays
  • Optoelectronic packaging
  • Chip-on-board (COB)
  • System in packages (SiPs)
  • Specialty lead frames
  • Automotive assemblies
  • Flex circuits
  • Multi-chip modules (MCMs)
  • Fine pitch devices
  • LEDs with running stitch
PALOMAR_8100_Launch_Video_09222020
VisionPilot

VisionPilot®

Utilizes advanced geometric pattern matching technology to reliably and accurately locate parts that are randomly oriented or have greyscale variations by using a set of boundary curves that are not tied to a traditional pixel-grid. Maximizes throughput, and enables part inspection both before and after bonding.

Bond Data Miner

Bond Data Miner

A comprehensive and centralized data management and analysis system that provides machine and process trend monitoring, storage and traceability of data across platforms, and closed loop process control for increased yields and predictive maintenance.

Intelligent Interactive Graphical Interface

Intelligent Interactive Graphical Interface® - i2Gi®

Supports advanced wire bond control through an intuitive interface that simplifies programming and provides real time graphical feedback to the user of bonding performance. Allows for a connected view with the ability to overlay 1:1 scaled graphics on top of live video of actual part.

Automated Handler System

Automated Handler System

Automated inline handlers and conveyor systems to seamlessly bring parts in and out of the workspace. Custom designed for all process to fit all components and even apply heat for bot die and wire applications. Built with integration in mind for fully automatic assembly lines that can include all of our bonders.

Vision Standardization

Vision Standardization

Automated calibration of image lighting across multiple bonders. Allows for seamless transfer of programs from bonder to bonder with zero time spent re teaching or adjusting references. Greatly reduces downtime when programs need to be updated and distributed across bonders.

Digitally Controlled NEFO Generator

Digitally Controlled NEFO Generator

Digitally controlled and displayed for precision parameter adjustments and real time process monitoring utilizing simple but comprehensive alerts. The graphical display of recent bonds facilitates effective process development.

sensors in new era defense

Sensors in New Era Defense

Show details

Calculating ROI when Purchasing Die or Wire Bonder Equipment

Show details
Packaging Technologies Meet Quantum Opportunities

Packaging Technologies Meet Quantum Opportunities: Part Two

Show details

The Resurgence of Brand Value

Show details

Die Bond Flexibility for Next Generation Photonics Packaging

Show details
v-bond wires

Improve Wire Bond Capability and Reliability Through Use of Auxiliary Wires

Show details

Contact us below and a representative will be in touch to help you with your wire bond needs.