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3130 Vacuum Pressure Furnace

The SST 3130 is a deep chamber resistive heat vacuum and pressure furnace for void free solder joints without the use of flux, resulting in high reliability electronic components. The 3130 provides precise automatic control of heating to 500°C (1000°C optional) and cooling in an inert gas environment from vacuum levels of below 50 millitorr to pressures exceeding 50 psig. The system is used in both production and research environments for flux-free soldering, brazing, annealing, and glass sealing of components and packages for microelectronic applications.

3130 Vacuum Pressure Furnace

The SST 3130 is a deep chamber resistive heat vacuum and pressure furnace for void free solder joints without the use of flux, resulting in high reliability electronic components. The 3130 provides precise automatic control of heating to 500°C (1000°C optional) and cooling in an inert gas environment from vacuum levels of below 50 millitorr to pressures exceeding 50 psig. The system is used in both production and research environments for flux-free soldering, brazing, annealing, and glass sealing of components and packages for microelectronic applications.

Category
Vacuum Reflow Systems

Processes
  1. Glass to Metal Sealing
  2. Hermetic Package Sealing
  3. Solder Paste Reflow Attach
  4. Fluxless Eutectic Solder Attach

Applications
  • Fiber Optic Laser Package Assembly
  • GaAs/GaN die attach
  • Glass to metal seals
  • Brazing
  • Pressure sensors

Media

3130 Open Chamber
3130 Operator Interaction
3130 Closed Chamber
3130 Tooling Example

KEY FEATURES

Formic Acid
Extended Temperature
Run Analyzer
Graphite Tooling
Formic Acid Extended Temperature Run Analyzer Graphite Tooling
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