Bond Data Miner
Bond Data Miner is a comprehensive and centralized data management and analysis system that provides machine and process trend monitoring for increased utilization and yields, along with predictive maintenance.
Category
Die Bond Features, Wire Bond FeaturesProcesses
- Silver Sintering Die Bonding
- Eutectic Die Bonding
- Epoxy Die Bonding
- UV Die Bonding
- Solder Paste Die Bonding
- Thermocompression Die Bonding
- Wedge Bonding
- Gold Wire Bonding
- Aluminum Wire Bonding
- Ball Bumping
Applications
- Large complex hybrids
- HB/HP LED arrays
- Optoelectronic packaging
- Microwave modules
- RF packages
- Hybrid microcircuits
- MEMS / MOEMS
- VCSEL, PD, DFB Laser, Lens Attach
- Solid state lasers
- RF GaN 5G power amplifiers
- RF power amplifier
Media
KEY FEATURES
Real-time Feedback
Data tracking and analysis presented during machine operation. Active feedback can be displayed for the current process in the form of placement accuracy, bond deformation and more.
Condense Data Across Multiple Systems
The software offers a single access point to pool not only multiple types of data but also data across other machines and model types for analysis and tracking. Compare process history across systems to optimize performance.
In-Depth Data Analysis
Trend data across multiple diagnostics, calibrations, and process runs to predict preventive maintenance and analyze machine conditions. Dissect and filter comprehensive diagnostics and run history with ease for powerful and targeted information.
Inventory and Bonding Stats
Catalogue bonding stats such as how many bonds a particular tool has made alongside tracking what specific components have been used for which assemblies. Keep records of all relevant information needed to maintain quality as a high priority.
Related Resources
26 Mar
11 Mar
27 Feb
