Photonics & Optoelectronics
Optical transceivers, photonic integrated circuits (PICs), laser diode assemblies, and quantum devices combine many components and several bonding techniques in one package. Getting the sequence right matters as much as getting each bond right.
How Palomar helps:
- High-accuracy die placement and fine wire bonding for dense packages
- Processes designed to reduce cycle time and cost in production
- Active alignment and Indium bump die attach
- Surface-activated direct bonding using plasma
Medical & Biophotonics
Implantable and wearable devices, diagnostic instruments, and life-science consumables increasingly rely on semiconductor and photonic components. They must fit smaller form factors, work in contact with human biology, and perform reliably for years.
How Palomar helps:
- Eutectic and epoxy die attach for uncommon materials and package styles
- Hermetic package sealing for long-term reliability
- Bond-level process data to support traceability
- High-reliability, deep-access wire bonding and ball bumping with custom geometries
Platforms Used in Photonics Assembly
Palomar Die Bonders
3880-II Die Bonder
Palomar Wire & Wedge Bonders
8100 Wire/Ball Bonder
Palomar Wire & Wedge Bonders
9100 Wedge Bonder
Sst High Vacuum Furnaces
3150 High Vacuum Furnace
Total Solution Partner
PROCESS
MASTERY
Human expertise for the hardest assembly challenges. Decades of application engineering that can solve problems that off-the-shelf equipment can't.
DEVELOPMENT TO PRODUCTION
Prototype, validate, and scale without switching vendors mid-program.
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BUILT FOR MISSION-CRITICAL COMPLEXITY
Precision and reliability for applications where failure isn't an option.
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AGILE CO-DEVELOPMENT
Equipment-agnostic by design: we collaborate around your challenge to find the quickest path to a validated process.
