Beyond the Basics: Identifying the Best Vacuum Reflow Systems for Your Assembly Needs

Topics Discussed:

• What value does a vacuum reflow system bring to semiconductor packaging, and when and why would it be used for an application. 
• What differentiates each SST vacuum reflow system from one another, ranging from the tabletop 1200 to the automated, high volume 8300 series.
• Which systems are optimal choices for different types of devices and processes.

Achieving Minimum Sealed in Gas Pressure via High Vacuum Hermetic Sealing with Getter Activation

Topics Discussed:

• Hermetic seal strength and the factors that contribute to it.
• Target vacuum levels during the sealing process and methods to reach pressures as low as possible.
• Getters and considerations for how they can be optimally activated without compromising the integrity of solder material during hermetic sealing.

Implementations of Cross Machine Communication and Factory Automation

Topics Discussed:

• What is possible to communicate and command through SECS/GEM.
• How Palomar systems utilize and interface with SECS/GEM.
• What some example host applications look like and what needs to be done on the factory end to make the most out of the communication channels integrated into Palomar machines.
  

Successful Void-Free Die Attach using a Die Bonder

Topics Discussed: 

• A comprehensive understanding of the mechanics behind eutectic bonding using a die bonder.
• Proficiency in deciding which tool, equipment, and material are best for a given application.
• Knowledge of the methods and techniques available to reduce voiding and improve bond quality.

Throughput is Not Just Machine Axis Speed

Topics Discussed:

• The tradeoffs between automation equipment that leads to bottlenecks.
• The importance of understanding the yield requirements.
• How to maximize machine production time.

Packaging Developments in 6G and Quantum Communications

Topics Discussed:

• The drivers, significance, impact, and timescale of the roll-out of 6G and quantum communications.
• The nature of the utilization and adaption of pick and place packaging technologies to develop and manufacture next-generation quantum devices servicing the 6G infrastructure.
• Examples of potential in lateral packaging applications for other devices serving the 6G/quantum ecosystem. 

Successful Void-Free Die Attach using Vacuum Reflow Systems

Topics Discussed:

• What is void-free die attach?
• Common applications requiring void-free die attach.
• Materials, tooling, and processes required for void-free die attach.

The Great Debate – Ball vs Wedge Bonding

Topics Discussed:

• When fine wire bonding is best considered.
• When wedge bonding is the best solution.
• What other technical aspects need to be considered.

A Solid Investment for Maximizing Productivity: The Palomar 3880-II

Topics Discussed:

• Maximizing production time to get the highest UPH.
• Expediting programming development.
• Unparalleled flexibility for any die bonding process.

The Journey to Full-Scale Semiconductor Packaging, Part 1: Manufacturability Challenges of Semiconductor Packages for Start-ups

Topics Discussed:

• Challenges of manufacturing semiconductor packaging.
• Tips for success with a small teams.
• How to take your package from design to full-scale production.

The Journey to Full-Scale Semiconductor Packaging, Part 2: Process Optimization Challenges of Semiconductor Manufacturing

Topics Discussed:

• Benefits of different forms of material presentation and when to use which for the highest throughput and performance.
• Techniques to setup a Palomar bonder work envelope and assembly procedure for optimal throughput.
• Which process parameters have the greatest effects on throughput and assembly quality and what their optimal values are for various applications.

The Journey to Full-scale Semiconductor Packaging, Part 3: Continual Improvement with High Volume Production

Topics Discussed:

• How to mitigate risk when implementing changes into a mature process.
• How to efficiently bring the next revision or new product into production while effectively maintaining the current process volume.
• How to reduce the potential for process disruption from personnel involved in production.

功率模块： 常见的失效现象及解决方案 (Power Modules: Typical Failure Modes and How to Solve Them)

Topics Discussed:

• Mechanical failures in the interconnects of power modules.
• DBC and baseplate and thermal mismatches.
• Flux-less soldering with less than 1% void.

Process Control & Traceability for Military and High Reliability Semiconductor Applications

Topics Discussed:

• How to actively monitor the process.
• Using automation for consistent results.
• Implementing traceability.

Efficient Manufacture of IR Sensors - Combining Bonding and Vacuum Reflow Technology

Topics Discussed:

• Market growth drivers.
• Cost-effective methods used to manufacture IR sensors.
• How to combine bonder and vacuum reflow technology.
  

Unparalleled Die Bonding Flexibility for Next-Gen Photonics Packaging

Topics Discussed:

• Challenges of photonics packaging.
• Live visit of Palomar's Demo Lab at EPIC.
• Live overview of the Palomar 3880 capabilities.

Balancing Throughput and Process Control for Manufacturing RF Power Amplifiers

Topics Discussed:

• Various process control options available.
• Corresponding effects on production, both positive and negative.
• Focus on increasing automated process control and limiting the resulting hits to throughput.

Power Modules: Typical Failure Modes and How to Solve Them

Topics Discussed:

• Mechanical failures in the interconnects of power modules.
• DBC and baseplate and thermal mismatches.
• Flux-less soldering with less than 1% void.

Taking Wire Bonding to New Levels of Efficiency and Productivity - Palomar 8100 Wire Bonder

Taking fine wire bonding to new levels of productivity for operators and engineers. The Palomar 8100 wire bonder is a fully automated, thermosonic high-speed ball-and-stitch wire bonder capable of ball bumping and customized looping profiles. 

Wedge Bond Process Optimization Method for 1.5 mil Al Wire on Al Bond Pad

This webinar will review the common challenges process engineers face when selecting a wedge bond machine configuration and developing robust processes. Wedge bond cases presented will show the tradeoff between process inputs and the resulting bond shapes, bond appearance of black ring, burrs, pull results, etc.