SST "QuikCool™" Auxiliary Cooling System

Previous blogs have detailed the value of using graphite elements and tooling for precise temperature control, wide temperature ranges, and dimensional stability of graphite tooling in vacuum reflow systems.

This void-free, flux-free solder process results in highly reliable eutectic die bonding and hermetically sealed electronic packages.

Many customers, though, ask how SST Vacuum Reflow Systems can help them increase batch production throughput, thus reducing the cost and increasing the volume of units produced, or UPH.

To address this, SST Vacuum Reflow Systems has introduced “QuikCool™, an optional auxiliary cooling system designed to rapidly reduce temperatures in SST’s Model 5100.

New_QK_B.pngBy quickly reducing the chamber’s temperature after reflow, process cycle time is reduced, thus allowing more production cycles per hour.

All this is designed to be performed in a single vacuum chamber, providing a simple soldering process, with no moving parts and requiring minimal handling by operators.

The patent-pending QuikCool™ water chiller unit is separate from the 5100, so it can be conveniently placed in your production facility while occupying minimal floor space. It is self-contained, so no facility modification is needed to install it with a Model 5100. Along with reducing consumption of gas and power, these features help reduce the cost of ownership of the complete vacuum reflow system.

While QuikCool™ is primarily designed to increase production output, our tests show that rapid cooling, can potentially reduce solder grain size thus increasing the reliability of the solder joint at the same time as soldering it faster. Similarly, our tests show using QuikCool™ results in very low void levels of 3% or less – so your output yields and bond reliability go up, adding further to the reliability and durability of the soldered interface.

So, by ordering a Model 5100 with the QuikCool™ option, you can benefit from - reduced cycle time and increased output; highly controlled, precise solder joints, reliable and flexible equipment and the control, temperature range and durability of graphite,  all in one chamber for reduced cost and handling.

Come visit us at iMAPS Pasadena, October 11-12, 2016.  Pasadena Convention Center.  Booth# 702.

Download these resources & for more information contact your SST Vacuum Reflow Systems representative.

Model 5100 Data Sheet QuikCool™ Data Sheet Void-Free/Flux Free Data Sheet


---
A.J. Wilson
President
SST International