Die Attach
- Epoxy Die Attach
- Conductive
- Non-conductive
- UV cure
- Snap cure
- Anisotropic adhesive
- Eutectic Die Attach
- Preform
- Pre-deposited / Back-side metalized
- Solder paste
- Void-free soldering, flux-free attach
- High Accuracy Component Placement
- Flip Chip
- Thermocompression
- Glass Sealing
- Wafer (up to 12”)
- Deep Access
Machines used: Palomar 3880-II, 6500 Die Bonders; SST 5100 Vacuum Reflow System