About

Palomar® Technologies is a leading supplier of automated microelectronic assembly machines and contract assembly services with specialization in precision die attach, wire bonding and vacuum reflow solutions. We are proudly an independent USA-based company, owned and operated by local management.

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Applications

Palomar® Technologies provides interconnect solutions for a wide variety of industries and applications. With 45+ years supporting the semiconductor and photonics industries, we have expanded across automotive (LiDAR & power modules), medical, microwave, RF/wireless, Datacom, telecom and a few niche markets.

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Overview


Innovation Centers

Palomar® Technologies Innovation Centers are full-service advanced packaging laboratories offering solutions for process development, package prototyping, die attach, wire bonding, vacuum reflow, outsourced package assembly, test, and measurement.

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Resources

Get access to our entire knowledge database: read blog articles and download materials.

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Contact Us

Contact Palomar® Technologies for more information about our Total Process Solution including Palomar die bonders, Palomar wire and wedge bonders, SST vacuum reflow systems, along with Innovation Centers for outsourced manufacturing and assembly.

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INNOVATION CENTER - usa

Serving Customers' Advanced Photonics and Microelectronics Packaging and Assembly Needs

Our Innovation Center – USA, run by our Assembly Services business unit, is strategically located within our headquarters’ in Carlsbad, CA.  Here, our highly skilled in-house engineering staff and technicians remain close to Palomar Technologies design and manufacturing engineers, providing a close feedback loop and reducing any downtime. Together, we’ll help you become the leader in your market by providing state-of-the-art assembly services that are capable of ultra-high precision die attach, wire bonding, ribbon bonding, and die sorting.

Turnkey die attach and wire bonding services. We’ll help you become the leader in your market by providing state-of-the-art assembly services that are capable of ultra-high precision die attach, wire bonding, ribbon bonding, and die sorting.

6305 El Camino Real - Palomar HQ

 

 

Innovation_Center_FINAL_07102020

 

 

Our laboratories offer:

  • Experienced engineering, purchasing and technical staff
  • Cost-effective alternative to investing in capital equipment
  • Immediate access to manufacturing expertise and increased capacity without staffing increases
  • Prototyping devices and manufacturing methods quickly and efficiently evaluated
  • Class 1000-10000 clean room spaces
  • Secure work areas with ITAR certification
  • Temperature, humidity, ionization control
  • Electro-static discharge (ESD)
  • Secure warehouse
  • Strict IP confidentiality

Die Attach


Machines used: Palomar 3880, 6500 Die Bonders; SST 5100 Vacuum Reflow System

Wire Bonding


Machines used: Palomar 8100, 9000 Wire Bonders

Additional Capabilities

  • Hermetic Package Sealing
  • High Vacuum MEMS Packaging
  • Die Sorting
  • Wire Pull Testing
  • Die/Shear Testing
  • Plasma Cleaning: single gas, multiple gas, argon, oxygen, forming gas
  • Encapsulation
  • Video Measurement
  • Scanning Acoustic Microscope (SAM)
  • Scanning Electron Microscope 

*Consigned test equipment floor space for special applications available

Machines used: Royce Tester, Royce Die Sorter, SST Vacuum Reflow, SCI Plasma Cleaning, Keyence VHX-1000, Nikon VMR, Sonix CSAM

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Innovation Center USA
Contact Palomar Innovation Center – USA
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Data Sheet White@2x.png 3880 Die Bonder
Data Sheet White@2x.png Technical Papers & eBooks
Data Sheet White@2x.png 8000i Wire Bonder
Data Sheet White@2x.png Process Development Services