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3250 High Vacuum Wafer Furnace

The SST 3250 is a high vacuum multi-atmosphere sealing furnace that has been designed for lid sealing on wafers of 150-200mm diameter. The system is fully operational at vacuum levels of 10E-07 Torr up to 12 psig with automatic selection and control of up to three process gasses. A closed-loop electronic pressure controller with integral capacitance manometer provides fine control of pressure and flow throughout the full operating range of the system.

3250 High Vacuum Wafer Furnace

The SST 3250 is a high vacuum multi-atmosphere sealing furnace that has been designed for lid sealing on wafers of 150-200mm diameter. The system is fully operational at vacuum levels of 10E-07 Torr up to 12 psig with automatic selection and control of up to three process gasses. A closed-loop electronic pressure controller with integral capacitance manometer provides fine control of pressure and flow throughout the full operating range of the system.

Category
High-Vacuum Furnaces

Processes
  1. Glass to Metal Sealing
  2. High vacuum MEMs Packaging
  3. Hermetic Package Sealing
  4. Solder Paste Reflow Attach
  5. Fluxless Eutectic Solder Attach

Applications
  • MEMS Package Sealing
  • Void-Free Eutectic Die Attach
  • Infrared Sensor Package Sealing
  • Low Moisture Package Sealing
  • Wafer Level Packaging
  • Military Electronic Package Sealing

Media

3250 Chamber View
3250 Application in Chamber Example
3250 Operator Interaction
3250 Chamber Open

KEY FEATURES

Run Analyzer
Graphite Tooling
Run Analyzer Graphite Tooling
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