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5100 Vacuum Pressure Furnace

The SST 5100 is a programmable vacuum/pressure furnace that creates void-free solder joints without the use of flux, resulting in high reliability electronic components. This system allows for heating up to 500°C and cooling in an inert gas environment from vacuum levels below 50 millitorrs to pressures up to 40 psig. Process heating is provided over the entire work area by a close-coupled planar infrared heating element. 

5100 Vacuum Pressure Furnace

The SST 5100 is a programmable vacuum/pressure furnace that creates void-free solder joints without the use of flux, resulting in high reliability electronic components. This system allows for heating up to 500°C and cooling in an inert gas environment from vacuum levels below 50 millitorrs to pressures up to 40 psig. Process heating is provided over the entire work area by a close-coupled planar infrared heating element. 

Category
SST Vacuum Reflow Systems

Processes
  1. Hermetic Package Sealing
  2. Solder Paste Reflow Attach
  3. Fluxless Eutectic Solder Attach

Applications
  • Flux-less Soldering
  • Hybrid Assembly
  • MMIC Die Attach
  • High Intensity LED Attach
  • Power Module Assembly
  • Eutectic Die Attach
  • Lead-Free Soldering 
  • PV Solar Cell Assembly
  • Hermetic Package Sealing
  • Flip Chip Assembly
  • Fiber Optic Packaging
  • Automotive Device Assembly

Media

5100 Operator Interaction
5100 Operator Interaction
5100 Chamber and Tooling
5100 Chamber and Tooling

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