Palomar® Technologies is a leading supplier of automated microelectronic assembly machines and contract assembly services with specialization in precision die attach, wire bonding and vacuum reflow solutions. We are proudly an independent USA-based company, owned and operated by local management.

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Palomar® Technologies provides interconnect solutions for a wide variety of industries and applications. With 45+ years supporting the semiconductor and photonics industries, we have expanded across automotive (LiDAR & power modules), medical, microwave, RF/wireless, Datacom, telecom and a few niche markets.

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Innovation Centers

Palomar® Technologies Innovation Centers are full-service advanced packaging laboratories offering solutions for process development, package prototyping, die attach, wire bonding, vacuum reflow, outsourced package assembly, test, and measurement.

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Contact Us

Contact Palomar® Technologies for more information about our Total Process Solution including Palomar die bonders, Palomar wire and wedge bonders, SST vacuum reflow systems, along with Innovation Centers for outsourced manufacturing and assembly.

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PTI Blog

Happy New Year from Palomar Technologies

Posted by Janine Powell on Tue, Jan 02, 2018 @ 02:03 PM

While we are now in what is called the "information age", it is easy to lose sight of the foundation of this information age—namely the fundamental engines of information flow—the complex devices that transfer, transmit and amplify data flow across a global network of satellite, fiber and wireless infrastructure. These engines of information flow, largely invisible and unknown to most cell phone and computer users, operating 24/7 without error.  We at Palomar play a central role in supporting and enabling continuing advances in the development and production of these complex devices, which include: lasers, sensors, and RF power amplifiers—thus enabling today’s "information age".Laptop Work-10.jpg

An increasingly connected and complex world drives a greater need for advanced electronic device technology and represents a robust future for Palomar Technologies. Networks of connected machines and sensors, called the Internet of Things (“IoT”), have the ability to monitor and manage objects in the physical world electronically, already impacting our everyday lives as demonstrated in the escalating trend of gadgets that talk to each other, learn from each other, and even control each other.  

Looking  ahead,  the  micro/opto electronics industry  will  continue  to  advance  requiring essential  competencies in  manufacturing smart and durable electronic systems, advanced  packaging  materials,  and  packaging  technology  for  extreme  environmental and high performance conditions. These advances require focus on a diverse set of success factors driven by Palomar’s areas of expertise—including value-end process, equipment, and material integration. Further, the precision and repeatability of Palomar equipment provides our customers a strategy to narrow the standard deviation of their product’s device parameters.

At Palomar, we are intimately knowledgeable of the end application, including its unique materials, processes, and production requirements—recognizing that the emergence and evolution of any package technology is driven by market trends as experienced by the end application. We are continually fine-tuning to ensure Palomar’s systems, process expertise, and customer support are globally positioned at the forefront of packaging technology.  Consequently, Palomar is well positioned to tackle the ongoing transformations and adjustments that will continue to be challenges in our field of complex micro/opto electronic packaging.

Here's to 2018!



Bruce Hueners
President & CEO
Palomar Technologies, Inc.