Palomar® Technologies is a leading supplier of automated microelectronic assembly machines and contract assembly services with specialization in precision die attach, wire bonding and vacuum reflow solutions. We are proudly an independent USA-based company, owned and operated by local management.
Palomar® Technologies provides interconnect solutions for a wide variety of industries and applications. With 45+ years supporting the semiconductor and photonics industries, we have expanded across automotive (LiDAR & power modules), medical, microwave, RF/wireless, Datacom, telecom and a few niche markets.
Palomar® Technologies Innovation Centers are full-service advanced packaging laboratories offering solutions for process development, package prototyping, die attach, wire bonding, vacuum reflow, outsourced package assembly, test, and measurement.
Contact Palomar® Technologies for more information about our Total Process Solution including Palomar die bonders, Palomar wire and wedge bonders, SST vacuum reflow systems, along with Innovation Centers for outsourced manufacturing and assembly.
Silver sintering die bonding or pressureless sintering die attach is unique from both solder and epoxies; it neither cures nor does it reflow. Sintered paste instead goes through a process akin to solid diffusion; that is, the metallic particles, generally silver, in the paste diffuse throughout the bonding area to create a strong thermal and electrical connection.
The sintering process in the past utilized high amounts of pressure or force to complete the bond, but pressure-less sintering proved to be the better solution. This process relies on the unique formulation of the sintering material to form a bond that is on par with the thermal and electrical conductivity of solder bonds, without needing to rely on flux or high temperature. There is much less concern about the voiding that comes with soldering processes than that which occurs when the solder liquefies.