About

Palomar® Technologies is a leading supplier of automated microelectronic assembly machines and contract assembly services with specialization in precision die attach, wire bonding and vacuum reflow solutions. We are proudly an independent USA-based company, owned and operated by local management.

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Applications

Palomar® Technologies provides interconnect solutions for a wide variety of industries and applications. With 45+ years supporting the semiconductor and photonics industries, we have expanded across automotive (LiDAR & power modules), medical, microwave, RF/wireless, Datacom, telecom and a few niche markets.

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Overview


Innovation Centers

Palomar® Technologies Innovation Centers are full-service advanced packaging laboratories offering solutions for process development, package prototyping, die attach, wire bonding, vacuum reflow, outsourced package assembly, test, and measurement.

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Resources

Get access to our entire knowledge database: read blog articles and download materials.

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Contact Us

Contact Palomar® Technologies for more information about our Total Process Solution including Palomar die bonders, Palomar wire and wedge bonders, SST vacuum reflow systems, along with Innovation Centers for outsourced manufacturing and assembly.

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PTI Blog

Automatic Epoxy Die Attach

Posted by Palomar Technologies MarCom Team on Thu, Aug 20, 2020 @ 03:00 PM

Epoxy die attach, sometimes referred to as epoxy die bonding, is the most commonly used die attach method. Whether dispensed or daubed via single pin or stamp transfer, it is a more cost-effective solution compared to eutectic bonding; this is due to lower material and process costs.

Typical epoxy die attach applications include: simple transistors, encapsulation of wire bonds, LED attachment, MCMs, and complexEpoxy_Die_Attach hybrids. Hybrid microcircuits, in particular, have seen tremendous growth in popularity due to their built-in flexibility and small package sizes. Aerospace and defense, medical, and optoelectronic device manufacturers have integrated the hybrid package to achieve multiple-need and multi-performance requirements.

With rapid time-to-market needs, automating the packaging process has become more critical than ever before. Epoxy die attach is a consistent, reliable, and flexible form of component attach. Automated epoxy dispense systems have kept up with these advances by maintaining a high level of control, handling, and integration through sophisticated process control software.

To learn more about epoxy daubing, epoxy dispensing and the conductive epoxy process, read our technical article: https://www.palomartechnologies.com/automatic-epoxy-die-attach-paper.

Also, download these resources for more information on solutions for epoxy die bonding:

3880 Die Bonder Brochure 6500 Die Bonder Brochure
3880 die bonder New Call to action

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Anders Schmidt
Applications Engineer II
Palomar Technologies, Inc.