Automatic Epoxy Die Attach

Epoxy die attach, sometimes referred to as epoxy die bonding, is the most commonly used die attach method. Whether dispensed or daubed via single pin or stamp transfer, it is a more cost-effective solution compared to eutectic bonding; this is due to lower material and process costs.

Typical epoxy die attach applications include: simple transistors, encapsulation of wire bonds, LED attachment, MCMs, and complexEpoxy_Die_Attach hybrids. Hybrid microcircuits, in particular, have seen tremendous growth in popularity due to their built-in flexibility and small package sizes. Aerospace and defense, medical, and optoelectronic device manufacturers have integrated the hybrid package to achieve multiple-need and multi-performance requirements.

With rapid time-to-market needs, automating the packaging process has become more critical than ever before. Epoxy die attach is a consistent, reliable, and flexible form of component attach. Automated epoxy dispense systems have kept up with these advances by maintaining a high level of control, handling, and integration through sophisticated process control software.

To learn more about epoxy daubing, epoxy dispensing and the conductive epoxy process, read our technical article:

Also, download these resources for more information on solutions for epoxy die bonding:

3880 Die Bonder Brochure 6500 Die Bonder Brochure
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Anders Schmidt
Applications Engineer II
Palomar Technologies, Inc.