High-Power LED Die Attach
High-power industrial LEDs depend on a clean thermal path. Voids under the die trap heat and shorten device life, and LEDs tend to shift during attach, which hurts reliability and yield downstream.
How Palomar helps:
- Tack LEDs in place first, then reflow in vacuum so they can't shift
- Void-free eutectic die attach for high-reliability bonds
- Controlled processing for temperature-sensitive LEDs
Wire Bonding and Multi-LED Assemblies
LED packages can carry anywhere from six to more than 1,000 LEDs per part, and each one needs a reliable connection. In one Palomar project, engineers placed tens of LEDs on a custom aluminum substrate and developed an AuSn preform process with near-zero voiding.
How Palomar helps:
- Fast, reliable wire connections from LED to substrate
- Die or wire bonding combined with vacuum reflow
- Process development for custom substrates and attach methods
Platforms Used in Laser Assembly
3880-II Die Bonder
5100 Vacuum Pressure Furnace
8100 Wire/Ball Bonder
Total Solution Partner
PROCESS
MASTERY
DEVELOPMENT TO PRODUCTION
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BUILT FOR MISSION-CRITICAL COMPLEXITY
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AGILE CO-DEVELOPMENT
SOLUTIONS built for
your application
Serving teams where assembly failure is not an option: in aerospace and defense, medical devices, photonics, advanced semiconductors, AI hardware, and quantum technology. If your application is complex, low-volume, and high-stakes, we know
your world.
