About

Palomar® Technologies is a leading supplier of automated microelectronic assembly machines and contract assembly services with specialization in precision die attach, wire bonding and vacuum reflow solutions. We are proudly an independent USA-based company, owned and operated by local management.

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Overview

Products

Palomar Die Bonders

Palomar Wire & Wedge Bonders

SST Vacuum Reflow Systems

SST High Vacuum Furnaces

Die Bond Features

Wire Bond Features

Vacuum Reflow Features

Applications

Palomar® Technologies provides interconnect solutions for a wide variety of industries and applications. With 45+ years supporting the semiconductor and photonics industries, we have expanded across automotive (LiDAR & power modules), medical, microwave, RF/wireless, Datacom, telecom and a few niche markets.

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Overview

Processes

Die Bonding

Wire Bonding

Vacuum Reflow

Innovation Centers

Palomar® Technologies Innovation Centers are full-service advanced packaging laboratories offering solutions for process development, package prototyping, die attach, wire bonding, vacuum reflow, outsourced package assembly, test, and measurement.

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Overview

Resources

Get access to our entire knowledge database: read blog articles and download materials.

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Overview

Contact Us

Contact us for more info about our Total Process Solution including die bonders, wire and wedge bonders, SST vacuum reflow systems, and Innovation Centers.

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Overview

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Innovation center - asia

Serving Southeast Asia’s Advanced Photonics and Microelectronics Packaging and Assembly Needs

Serving Asia Pacific’s advanced packaging and assembly requirements, our Innovation Center – Asia is strategically located in Singapore – a world-class technology hub. The first-of-its-kind in Southeast Asia, Palomar Technologies’ Innovation Center – Asia offers local companies unprecedented access to an expert-designed automated, complex photonic and microelectronic assembly process that is both cost-effective and reliable. It will also offer companies low-volume prototyping and process development service for the assembly of chip technology that enables the Internet-of-Things (IoT) and 5G wireless. 

  • Process development for new processes
  • Prototyping of new products
  • Metrology and digital measurement
  • Wire pull testing and die shear test
  • Dedicated time-on-machine rentals
  • Full automation to perform assembly processes 24 hours a day / 7 days a week
Singapore

 

Innovation_Center_FINAL_07102020

 

Our Team

Our engineering group is made up of technical specialists with extensive application experience in advanced die bonding and wire bonding processes. Our specialists are experts on using Palomar’s tools to deliver a robust packaging solution for our customers.

Improving your product’s tested yield, realizing efficiencies using parallel processing and ensuring you are designing your product for automation are some of the unique insights we can deliver.

What We Do:

Our Application Expertise:

  • Micro optics used in 3D Imaging, LIDAR and Optical Sensors
  • RF LDMOS and RF GaN power amplifiers
  • High-reliability RF Microwave modules
  • Silicon Photonics and laser diode placement bonding
  • Thermal and Motion Sensors
  • Optical transceiver packaging
  • Active Optical Cable packaging
  • VCSEL, EEL, EML, LED placement and bonding
  • Lens placement and lens attach bonding
  • Virtual Reality component display packaging

Our Tools:

Download the Brochure

Innovation Center - Asia
Contact Palomar Innovation Center – Asia
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Data Sheet White@2x.png 3880-II Die Bonder
Data Sheet White@2x.png Technical Papers & eBooks
Data Sheet White@2x.png 8100 Wire Bonder
Data Sheet White@2x.png Process Development Services