What We Do:
- Gold Wire Bonding
- Gold Ball Bumping
- Wedge Bonding, Gold and Aluminum wire
- Epoxy Die Bonding
- Eutectic Die Bonding
- Component placement
- Flip chip processes
Serving Southeast Asia’s Advanced Photonics and Microelectronics Packaging and Assembly Needs
Serving Asia Pacific’s advanced packaging and assembly requirements, our Innovation Center – Asia is strategically located in Singapore – a world-class technology hub. The first-of-its-kind in Southeast Asia, Palomar Technologies’ Innovation Center – Asia offers local companies unprecedented access to an expert-designed automated, complex photonic and microelectronic assembly process that is both cost-effective and reliable. It will also offer companies low-volume prototyping and process development service for the assembly of chip technology that enables the Internet-of-Things (IoT) and 5G wireless.
- Process development for new processes
- Prototyping of new products
- Metrology and digital measurement
- Wire pull testing and die shear test
- Dedicated time-on-machine rentals
- Full automation to perform assembly processes 24 hours a day / 7 days a week
Our Team
Our engineering group is made up of technical specialists with extensive application experience in advanced die bonding and wire bonding processes. Our specialists are experts on using Palomar’s tools to deliver a robust packaging solution for our customers.
Improving your product’s tested yield, realizing efficiencies using parallel processing and ensuring you are designing your product for automation are some of the unique insights we can deliver.
Our Application Expertise:
- Micro optics used in 3D Imaging, LIDAR and Optical Sensors
- RF LDMOS and RF GaN power amplifiers
- High-reliability RF Microwave modules
- Silicon Photonics and laser diode placement bonding
- Thermal and Motion Sensors
- Optical transceiver packaging
- Active Optical Cable packaging
- VCSEL, EEL, EML, LED placement and bonding
- Lens placement and lens attach bonding
- Virtual Reality component display packaging
Our Tools:
- Palomar 3880-II Die Bonder
- Palomar 9000 Wedge Bonder (Al & Au)
- Palomar 8100 Wire Bonder, Ball/Stud Bumper (Au)
- Keyence VHX-6000 Digital Microscope
- Royce 650 Pull Test, Die Shear tester
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Contact Palomar Innovation Center – Asia
