RESEARCH INITIATIVE - FRAUNHOFER IISB
Advancements in Power Electronics & Automotive Microelectronics Packaging
Palomar Technologies works with research institutes around the world to contribute to the development and advancement of techniques and technologies key to microelectronics packaging for semiconductor industry. Our work with these institutes results in new processes, new products, or new applications for our customers.
Palomar Technologies subsidiary, SST Vacuum Reflow Systems is working closely with the Fraunhofer Institute for Integrated Systems and Device Technology IISB in the area of high-quality, void-free power module packaging for electric vehicles.
The Fraunhofer Institute for Integrated Systems and Device Technology IISB conducts applied research and development in the field of electronic systems for application in, e.g., electric mobility, aerospace, Industry 4.0, power grids or energy technology. In this connection, the institute uniquely covers the entire value chain – from basic materials to whole power electronic systems.
As part of the cooperation, Palomar has placed a SST 8301 Automated Vacuum Soldering System within the Fraunhofer Institute. It will be available for demonstrations, prototypes, and research projects focusing on key components inside power electronics, dies to DBC, connectors/pins to DBC and DBC to base plate soldering.
The SST 8300 Series Automated Vacuum Pressure System offers superior bond technology for soldering and/or sintering processes. The entire process takes place in a single chamber with a single profile, however, additional chambers can be added or upgraded in the field as production capacity needs increase.
The SST 8301 is the only solution to use both vacuum pressure and pressure above atmospheric, serving to drive voids close to zero. This technology solves the key problem of voiding and thermal mismatches with the larger surface area attachments in the critical DBC to Baseplate joint. The 8301 is capable of a reliable flux-less soldering with less than 1% voiding, significantly improving yielded throughput.