Epoxy Die Bonding

Fast, Low-Temperature Attach With Easy Rework

Epoxy die bonding, sometimes called epoxy attach or thermal cure epoxy attach, is one of the most common die bonding methods in the industry because of its price point and speed. It comes in two main varieties: conductive and non-conductive. Conductive epoxy attach is used in a wide variety of applications and generally consists of applying a bed of epoxy underneath a die to form a thermal and electrical connection between the die and the substrate.

Versatile Application, Faster Processing

Non-conductive epoxy can provide structural support for components, encapsulate wire bonds, or act as a non-conductive barrier to prevent shorting. Epoxy can be deposited through dispensing (time-pressure, auger, or jetting), daubing, or pin transfer.

Epoxy applications are quicker than some alternatives, such as solder or eutectic attach, because components placed into the epoxy hold their positions throughout handling. This is especially beneficial for assemblies that go through a batch oven cure later in the process. Epoxies also cure at much lower temperatures than solder requires to melt, and they don't need high force, an inert environment, or scrubbing to create a good bond.

Easy Rework and Precise Flip-Chip Dispensing

Epoxy also allows for easy rework. Until the assembly goes through a cure cycle, a component attached with epoxy can be removed and replaced.

Epoxy attach is useful for both general die attach and flip-chip processes where fine control of epoxy is required. Palomar’s die bonders can apply tightly controlled, small volumes of epoxy onto bumps for flip-chip attach, while also using automatic pattern recognition to align the bumps and complete the flip-chip application.