Palomar® Technologies is a leading supplier of automated microelectronic assembly machines and contract assembly services with specialization in precision die attach, wire bonding and vacuum reflow solutions. We are proudly an independent USA-based company, owned and operated by local management.
Palomar® Technologies provides packaging solutions for a wide variety of industries and applications. With 45+ years supporting the semiconductor and photonics industries, Palomar now supports a wide range of industries including automotive, lasers, LEDs, medical & bio photonics, military/high reliability/MEMS, power semiconductors, RF/microwave/wireless, sensors and telecom/5G/Datacom. Select your industry to learn about Palomar’s solutions.
Palomar Technologies has a worldwide team of engineering experts trained to maximize system uptime and to support production needs of customers around the globe.
Palomar® Technologies offers multiple locations with full-service OSAT laboratories which provide volume manufacturing, process development, package prototyping, assembly, test, and measurement for processes such as die attach, wire bonding, vacuum reflow, and more.
Get access to our entire knowledge database: read blog articles and download materials.
Contact us for more info about our Total Process Solution including die bonders, wire and wedge bonders, SST vacuum reflow systems, and Innovation Centers.
Meet our corporate management and worldwide sales team for all of Palomar Technologies, Inc.
Join Nicholas Evans as he discusses the role of Assembly Services in driving innovation.
Serving Asia Pacific’s advanced packaging and assembly requirements, Rich Hueners discusses Assembly Services in Singapore.
A conversation with Redzuan Zin as he discusses Assembly Services Asia even more in-depth.
Watch an in-depth interview with Tobias Pidde, Operations Manager of Assembly Services in Germany.