Introducing the New 3880-II Die Bonder
A solid investment for maximizing productivity – from R&D to volume, automated bonding – all in one bonder. The new Palomar 3880-II Die Bonder is based on Palomar’s proven die bonder design but includes options to even further maximize productivity, reduce programming time by up to 95%, and improve the overall bonder productivity. The highly flexible Palomar 3880-II is ideally suited for a range of markets and applications.
SERVING EUROPEAN PHOTONICS AND MICROELECTRONICS CUSTOMERS
Palomar’s Demonstration / Prototyping Lab is strategically located within the new Electronics and Photonics Innovation Center (EPIC) in Paignton (Torbay), the heart of a vibrant electronics and photonics cluster in the United Kingdom. EPIC is a center of excellence, supporting technological innovation and promoting collaborative activity between businesses and research institutions. LEARN MORE ABOUT OUR DEMO LAB!
TAKE A TOUR OF THE PALOMAR TECHNOLOGIES HQ IN CARLSBAD, CA
Palomar® Technologies is a leading supplier of automated microelectronic assembly machines and contract assembly services with specialization in precision die attach, wire bonding and vacuum reflow solutions. We are proudly an independent USA-based company, owned and operated by local management. Take a virtual tour of our new 70,000 sq ft facility in Carlsbad, CA. LEARN MORE!
INTRODUCING THE PALOMAR 8100 WIRE BONDER (BALL/STUD BUMPER)
The newest Palomar fully automated, thermosonic high-speed, ball-and-stitch fine wire bonder capable of ball bumping and customized looping profiles. Based on Palomar’s proven wire bonder design and incorporating the latest productivity technology and operator ergonomics, making it the next generation of fine wire bonders. LEARN MORE!
News and Events
iMAPS Device Packaging
Optical Fiber Communication Conference
WEBINAR: The Great Debate – Ball vs Wedge Bonding