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518 Vacuum Pressure Furnace

The SST 518 Vacuum/Pressure furnace provides the right combination of performance and value for use in R&D labs and high mix/low volume production environments. Void-free, flux-free solder joints are reliably obtained through a carefully controlled and sequenced combination of heat, vacuum, and pressurized inert gas.

518 Vacuum Pressure Furnace

The SST 518 Vacuum/Pressure furnace provides the right combination of performance and value for use in R&D labs and high mix/low volume production environments. Void-free, flux-free solder joints are reliably obtained through a carefully controlled and sequenced combination of heat, vacuum, and pressurized inert gas.

Category
Vacuum Reflow Systems

Processes
  1. Hermetic Package Sealing
  2. Solder Paste Reflow Attach
  3. Fluxless Eutectic Solder Attach

Applications
  • Void-Free Eutectic Die attach
  • Hermetic Package Sealing to MIL-STD
  • Flux-Free Solder Process Development
  • Assembly of High Reliability Microelectronic Packages
  • Hybrid Microelectronic Circuit Assembly
  • Fiber Optic Package Assembly

Media

518 Chamber View
518 Interface and Display View
518 Application Example
518 Application Example

KEY FEATURES

Formic Acid
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