Palomar® Technologies is a leading supplier of automated microelectronic assembly machines and contract assembly services with specialization in precision die attach, wire bonding and vacuum reflow processes. High-precision assembly systems enable customers to increase yield and reduce costs in the manufacturing of optoelectronic, RF and power module packages.
Vision: To enable our customers to be leaders in their markets.
Start with a conversation. Let’s meet, face-to-face, to talk about your needs. Then our on-site R&D team will get right to work — imagining, developing and finalizing an innovative packaging solution to meet your unique goals. Because we’ve worked with so many clients in so many industries, we have a wealth of experience and understanding, and we use that expertise to work side-by-side with you, offering real-world advice for your most pressing packaging challenges. From active listening, to diagnostics, to successful solution development, we’re with you every step of the way.
It’s not about tomorrow, it’s about today. That’s why we offer totally installed, quick-turn package solutions that are ready to generate revenue for you on day one. You’ll receive full operational support to get your product off the ground and into market at top speed. Whether you require open atmosphere packaging or advanced packaging under vacuum and pressure, we have an accurate and reliable option to meet your needs, including high-accuracy die attach, wire bonding, glass to metal sealing, high vacuum MEMS, wafer level packaging & bonding.
Generate rapid ROI with Palomar. We’re here to make sure you look good for your customers, and we do that by helping you create optimized package assembly systems that will satisfy not just your needs, but theirs. By working with Palomar, you’ll be able to get your product off the ground and into market, generating ROI as rapidly as possible. We make it easy for you to get started – and start making money – much faster than you can with competitive products. You can work with us for rapid-prototype short runs in advance of full-scale production at your facility, or use our complete line of services for smaller-volume projects.
Supporting customers with requirements to learn the viability of a new product in the market without having to make an investment into capital equipment. Accomplishing product viability by providing a prototyping and process qualification service, coupled with final parts, assembled and tested. All assembly and packaging is performed by Palomar engineers on Palomar bonders and vacuum reflow systems enabling customers a rapid transition to high volume production for future growth.
In March 2015, Palomar Technologies acquired SST International, a turnkey supplier of vacuum and pressure furnaces for soldering, brazing, glass-sealing, and wafer bonding of microelectronic packages and components. SST International, now known as SST Vacuum Reflow Systems, complements Palomar’s existing line of wire and die bonders, making Palomar Technologies the premier global single source for precision assembly and hermetic packaging of electronic components.
Supporting customers over the life of the equipment is a critical factor in Palomar’s total solution. Our customer service team provides immediate access to thousands of Spare Parts, on-site and factory training, system upgrades and advanced process development. Extended warranty service contracts are also available and administered by our North America,