About

Palomar® Technologies is a leading supplier of automated microelectronic assembly machines and contract assembly services with specialization in precision die attach, wire bonding and vacuum reflow solutions. We are proudly an independent USA-based company, owned and operated by local management.

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Applications

Palomar® Technologies provides interconnect solutions for a wide variety of industries and applications. With 45+ years supporting the semiconductor and photonics industries, we have expanded across automotive (LiDAR & power modules), medical, microwave, RF/wireless, Datacom, telecom and a few niche markets.

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Overview


Innovation Centers

Palomar® Technologies Innovation Centers are full-service advanced packaging laboratories offering solutions for process development, package prototyping, die attach, wire bonding, vacuum reflow, outsourced package assembly, test, and measurement.

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Get access to our entire knowledge database: read blog articles and download materials.

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Contact Us

Contact Palomar® Technologies for more information about our Total Process Solution including Palomar die bonders, Palomar wire and wedge bonders, SST vacuum reflow systems, along with Innovation Centers for outsourced manufacturing and assembly.

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PTI Blog

Lid Sealing versus Seam Sealing

Posted by Palomar Technologies MarCom Team on Wed, May 20, 2020 @ 03:00 PM

While lid sealing has been around for many years and is considered a legacy technology, it is helpful to revisit the topic and consider how lid sealing compares to seam sealing. By understanding the technology and its typical uses and within the context of individual package designs, the ability to determine which method to select improves the likelihood of success. The key factors to consider when choosing Lid_Sealing VS_Seam_Sealing_Electronic_Packageseither technology are the thermal impact on the components that are being sealed inside the package, the hermeticity level (Hermetic – Non-Hermetic), and the production volume.

First, determine if the package was designed for seam sealing or lid sealing by reviewing what the thermal impact is on the components being sealed inside the package. If the components inside the package can withstand the melting temperature of the solder alloy, then it can be a candidate for the lid sealing process. If not, the seam welding process most likely will need to be used or alternative material, such as epoxy, for sealing the package. Next, determine the hermeticity level (Hermetic – Non-Hermetic). If high-reliability sealing is required for the package, lid sealing is required. If the package is non-hermetic, then a decision will need to be made on the type of epoxy used to seal the lid. If there is a need for a specific vacuum or pressure level or a specific gas to be sealed inside the package, then the choice for the process must be lid sealing.  And lastly, defining the UPH requirement will determine which sealing method is best used for the package design.

Download our technical article and read more about these two sealing technologies:

Lid Sealing versus Seam Sealing SST 5100 Vacuum Pressure Furnace Brochure
Technical Considerations of Lid Sealing versus Seam Sealing for Electronic Packages New Call-to-action