About

Palomar® Technologies is a leading supplier of automated microelectronic assembly machines and contract assembly services with specialization in precision die attach, wire bonding and vacuum reflow solutions. We are proudly an independent USA-based company, owned and operated by local management.

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Applications

Palomar® Technologies provides interconnect solutions for a wide variety of industries and applications. With 45+ years supporting the semiconductor and photonics industries, we have expanded across automotive (LiDAR & power modules), medical, microwave, RF/wireless, Datacom, telecom and a few niche markets.

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Overview


Innovation Centers

Palomar® Technologies Innovation Centers are full-service advanced packaging laboratories offering solutions for process development, package prototyping, die attach, wire bonding, vacuum reflow, outsourced package assembly, test, and measurement.

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Resources

Get access to our entire knowledge database: read blog articles and download materials.

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Contact Us

Contact Palomar® Technologies for more information about our Total Process Solution including Palomar die bonders, Palomar wire and wedge bonders, SST vacuum reflow systems, along with Innovation Centers for outsourced manufacturing and assembly.

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Palomar® Technologies provides solutions for a wide variety of application requirements for the first level interconnect of microelectronic packages. Its fundamental capabilities of large area, high-precision attach, and high-performance assembly make Palomar Technologies the supplier of choice.
The optoelectronic market falls under two categories: telecommunications and consumer. Palomar Technologies provides solutions in both categories and serves customers worldwide with a variety of applications. Palomar Technologies manufactures and services highly advanced optoelectronic assembly packaging systems that achieve high-yield, high purity, exceptional heat transfer, and precision.
As the world now depends on radio frequency engineering, Palomar Technologies continues to perform high-yield, extremely accurate RF packaging. Whereas its focus used to be the low-volume aerospace and defense industry, now it encompasses multiple industries across the broad and high-volume commercial market. RF applications require great attention to detail when packaging—the higher the frequency at which the package operates, the more critical the die and wire placement becomes. Palomar Technologies ensures such crucial steps are met.
Palomar Technologies is a former division of Hughes Aircraft, which was a major player in the early avionics, aerospace, and defense industry. Hughes pioneered high-reliability microelectronic assembly equipment and processes by developing precision bonding equipment that would build aerospace, satellite communications, and military devices. Today, Palomar Technologies continues to build upon the legacy of Hughes Aircraft, contributing to military and aerospace innovations.