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Palomar Technologies
  • About
    About

    Palomar® Technologies is a leading supplier of automated microelectronic assembly machines and contract assembly services with specialization in precision die attach, wire bonding and vacuum reflow solutions. We are proudly an independent USA-based company, owned and operated by local management.

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    Overview
    Company Overview Corporate Information Events
    Press Releases Employment Opportunities Meet the Palomar Team
  • Products
    Products
    • Overview>
    • Palomar Die Bonders>
    • Palomar Wire & Wedge Bonders>
    • SST Vacuum Reflow Systems>
    • SST High Vacuum Furnaces>
    • Die Bond Features>
    • Wire Bond Features>
    • Vacuum Reflow Features>
    Palomar Die Bonders
    3880-II Die Bonder 6532HP Die Bonder 6500 Die Bonder
    Palomar Wire & Wedge Bonders
    9000 Wedge Bonder 8100 Wire/Ball Bonder
    SST Vacuum Reflow Systems
    8300 Series Automated Vacuum Pressure Soldering System 5100 Vacuum Pressure Furnace 3130 Vacuum Pressure Furnace 1200 Table Top Furnace 518 Vacuum Pressure Furnace
    SST High Vacuum Furnaces
    3150 High Vacuum Furnace 3250 High Vacuum Wafer Furnace
    Die Bond Features
    Bond Data Miner Pulsed Heat Systems VisionPilot® Wafer Die Ejection Systems
    Wire Bond Features
    Bond Data Miner Intelligent Interactive Graphical Interface® (i2Gi®) VisionPilot®
    Vacuum Reflow Features
    Graphite Tooling
  • Applications
    Applications

    Palomar® Technologies provides packaging solutions for a wide variety of industries and applications. With 45+ years supporting the semiconductor and photonics industries, Palomar now supports a wide range of industries including automotive, lasers, LEDs, medical & bio photonics, military/high reliability/MEMS, power semiconductors, RF/microwave/wireless, sensors and telecom/5G/Datacom. Select your industry to learn about Palomar’s solutions.

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    Overview
    Automotive Lasers LEDs Medical & Bio Photonics Military, High Reliability & MEMS
    Photonics Power Semiconductors RF, Microwave & Wireless Sensors Telecom, 5G & Datacom
  • Processes
    Processes
    • Overview>
    • Die Bonding>
    • Wire Bonding>
    • Vacuum Reflow>
    Die Bonding
    Epoxy Die Bonding UV Die Bonding Solder Paste Die Attach Eutectic Die Bonding Silver Sintering Die Bonding Thermocompression Die Bonding
    Wire Bonding
    Gold Wire Bonding Aluminum Wire Bonding Ball Bumping Wedge Bonding
    Vacuum Reflow
    Glass to Metal Sealing High Vacuum MEMs Packaging Hermetic Package Sealing Fluxless Eutectic Solder Attach Solder Paste Reflow Attach Pressureless Sintering Die Attach
  • Services
    Services

    Palomar Technologies has a worldwide team of engineering experts trained to maximize system uptime and to support production needs of customers around the globe.

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    Overview
    Service Contracts Service Calls Training System Upgrades
    Process Development Prototyping/Contract Manufacturing (OSAT) Prepare for Manufacturing
  • Assembly and Test Labs
    Assembly and Test Labs

    Palomar® Technologies offers multiple locations with full-service laboratories which provide volume manufacturing, process development, package prototyping, assembly, test, and measurement for processes such as die attach, wire bonding, vacuum reflow, and more.

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    Overview
    Assembly and Test - North America Assembly and Test - Asia
    Assembly and Test - Europe Research Center, Fraunhofer IISB - Europe
  • Resources
    Resources

    Get access to our entire knowledge database: read blog articles and download materials.

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    Overview
    Blog Brochures
    Technical Papers & eBooks Videos & Webinars
  • Contact Us
    Contact Us

    Contact us for more info about our Total Process Solution including die bonders, wire and wedge bonders, SST vacuum reflow systems, and Innovation Centers.

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    Overview
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    Service
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  • Brochures

RESOURCES

  • Brochures
  • Technical Papers & eBooks
  • Videos & Webinars
  • Services
RESOURCES
  • Brochures
  • Technical Papers & eBooks
  • Videos & Webinars
  • Services
Product and Services Brochures
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3880-II Die Bonder
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6500 Die Bonder
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6532HP Die Bonder
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8100 Wire Bonder
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9000 Wedge Bonder
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Advanced Solutions Division - Asia
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Advanced Solutions Division - Europe
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Advanced Solutions Division - USA
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Bonder Training
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Field Services Support
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Graphite Machining
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Palomar Process Development Services
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SST Process Development
SST Product Line: Vacuum Reflow Systems
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SST 8300 Series Automated Vacuum Pressure System
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SST 5100 Vacuum Pressure Furnace
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SST 3130 Vacuum Pressure Furnace
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SST 518 Vacuum/Pressure Furnace
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SST 1200 Table Top Furnace
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SST 3150 High Vacuum Furnace
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SST 3250 High Vacuum Wafer Furnace
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Wafer Die Ejection Systems
Bonder Options Brochures
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Pulsed Heat System
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i2Gi®: Intelligent Interactive Graphical Interface®
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VisionPilot® with Radar Referencing®
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QuikCool™ Auxiliary Cooling Unit
Palomar Technologies

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