PTI Blog

Void Free Eutectic Attach

This is Part 2 of "Eutectic Die Bonding 101". There are 10 process variables that exist, four of which Palomar is in the business of ...

Posted by Palomar Technologies MarCom Team on

Eutectic Die Bonding 101

Eutectic Bonding - Why is it Necessary? This Eutectic Bond consists of three key aspects: The Electrical Contact The Primary Heat Interface ...

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Component Design for Complex MEMS

For today's MEMS manufacturer, low volume and high complexity are no longer subject to only manual packaging processes. Automation is here, ...

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Automating MEMs Packaging

The Micro-Electro-Mechanical Systems (MEMS), which once existed only in the university laboratory, are common in many commercial products ...

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Eutectic Process Critical Control Parameters

If making an investment in an automated eutectic bonding system, getting the right partners and the right process (the first time) will ...

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Eutectic Process in LED Assembly

Critical to the LED assembly process is a void-free eutectic solder interface between the diode and its substrate - this provides the ...

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High-brightness Matrix LED packaging

LED-based applications are growing and cover a broad range of markets including automotive lighting applications such as indicators, sport ...

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Benefits of Bonder Automation

I came accross an old PPT presentation authored by our CEO back in 1996,titled "Benefits of Automation". I am inspired to share it with you ...

Posted by Palomar Technologies MarCom Team on

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