Semiconductor packaging industry experts are continually reworking designs to reduce application package size—however, there remain a ...

Posted by Palomar Technologies MarCom Team on March 21

High power transistor, laser and LED devices require packaging to remove thermal energy from the die. Although some silver filled epoxies ...

Posted by Palomar Technologies MarCom Team on March 12

I think none of us would hesitate to say that things change pretty fast in this modern world. The pace of technology is just staggering. ...

Posted by Palomar Technologies MarCom Team on February 25

One frequently asked question when addressing high-power wire bonding applications is “how many wires do I need?” As a common ...

Posted by Palomar Technologies MarCom Team on February 17

With the successful deployment of the Pulse Heat Stage (PHS) system from Palomar Technologies, our field sales and engineering teams often ...

Posted by Palomar Technologies MarCom Team on February 1

Whether it is for a critical biomedical device, the latest spacecraft or military weapon system or just your new big screen TV at home, the ...

Posted by Palomar Technologies MarCom Team on January 20

Device thermal management has become more essential as packages run at higher frequencies and higher power levels. Designers are thinning ...

Posted by Palomar Technologies MarCom Team on January 15

There is no shortage of good ideas. What is rare, and valuable, is the execution of a good idea. This is most important in the context of ...

Posted by Palomar Technologies MarCom Team on September 16

Advanced Packaging Software is arguably where a die or wire bonder is enabled to stretch and accomplish some extraordinary application ...

Posted by Palomar Technologies MarCom Team on August 27

Today's production facilities have their own unique set of components, design characteristics and assembly requirements. Before purchasing ...

Posted by Palomar Technologies MarCom Team on August 9