Wafer Bumping using a Ball (Stud) Bumping System
Wafer bumping involves putting a conductive material on each die pad on a wafer to attach it to a package or circuit board forming the ...
Posted by Palomar Technologies MarCom Team on
PTI Blog
Wire Bonding - Gold Ball Bumping
Gold-ball bumping - or stud bumping - can be accomplished with commercially available gold wire bonders using a 1-mil gold wire. In fact, ...
Posted by Palomar Technologies MarCom Team on
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