Advanced Packaging Software is arguably where a die or wire bonder is enabled to stretch and accomplish some extraordinary application ...

Posted by Palomar Technologies MarCom Team on August 27

Today's production facilities have their own unique set of components, design characteristics and assembly requirements. Before purchasing ...

Posted by Palomar Technologies MarCom Team on August 9

Semicon West 2010 was an important show for Palomar, most especially due to the launch of Palomar's new 3800 Ultra Flexible Die Bonder. The ...

Posted by Palomar Technologies MarCom Team on July 23

As a software engineer, I don’t often get to go to trade shows, but Semicon West 2010 was one I could not miss. After working intensely ...

Posted by Palomar Technologies MarCom Team on July 16

July 13th - The DAY We are now only days away from Semicon West 2010, which opens at 10 AM on Tuesday, July 13th at the Moscone Center in ...

Posted by Palomar Technologies MarCom Team on July 8

Continuing on with our overview of microelectronic interconnection methods, we will discuss three additional methods: Solder Bump Bonding, ...

Posted by Palomar Technologies MarCom Team on May 24

Quick note: "Other" in the suject is referring to wire bonding and die attach, and the sub-sets that come with them, ie epoxy, eutectic, ...

Posted by Palomar Technologies MarCom Team on May 10

This is Part 3 of our series on Manufacturing in North America. The following case study is an excellent example of North America's low ...

Posted by Palomar Technologies MarCom Team on April 23

Taking from our last post, we determined that the playing field of contract assembly in complex microelectronics, in regards to cost has ...

Posted by Palomar Technologies MarCom Team on January 22

This is the first of a multi-part blog series about North America having become a true competitor in the world of complex microelectronic ...

Posted by Palomar Technologies MarCom Team on January 5