Successful Void-Free Die Attach using Vacuum Reflow Systems

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There are many factors to consider when it comes to achieving desirable die attach and lid seal bonding; one of the most important of these factors is solder interface voiding. Voids in the solder interface contribute to various failure modes including overheating via non-uniform dissipation of heat and high mechanical stresses. Vacuum reflow systems offer solutions to achieve low solder interface voiding through chamber pressure manipulations and surface treatment options. In addition, the correct solder material selection is key in achieving excellent bond quality. Each application is unique and requires careful consideration when it comes to solder material selection.   
In this webinar, proper material, solder, and process/tooling selection are explored to provide a successful void-free die attach using a vacuum reflow system. In addition, several case studies are presented to demonstrate how proper selections make a difference.

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Successful Void-Free Die Attach Webinar


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