Achieving Minimum Sealed in Gas Pressure via High Vacuum Hermetic Sealing with Getter Activation
Download the Webinar!The number of particles within a hermetically sealed device often have significant effects on not only the product’s performance but also its longevity. From impacting the potential image clarity of various IR sensors to possibly increasing the lifespan of MEMs devices destined for space by an extra few years; sealed-in-gas pressure is an important metric not only to measure but also to prioritize during assembly. The final pressure within a hermetically sealed package is affected by numerous factors, such as hermetic seal quality, environmental pressure at the time of sealing, and sources of particles within the sealed volume. To combat any potential outgassing or particle generation, getters (adsorbent materials) are usually used within the device.
Understanding the tools available to reduce sealed-in-gas pressure for hermetic seal applications optimally is critical to maximizing the effectiveness of your end product. This webinar explores the many techniques available for minimizing long-term particle presence in hermetic packages. Using Palomar’s SST 3150 as an example tool for hermetic seal applications, the following elements are explored in detail:
Seal strength and the factors that contribute to it, such as:
- Surface metallization layer thicknesses and purity
- Solder material and form choice
- Surface and solder preparation and treatment
Environmental vacuum level and methods to reach pressures as low as possible, including:
- Auxiliary mechanisms to draw moisture and particles out of the chamber
- Specific, intentional chamber design choices to prevent “particle sticking”
Getters and considerations for how they can be optimally activated during hermetic sealing:
- Protecting the integrity of solders while thermally activating getters
- Creating separate thermal zones in a single high vacuum environment
- Solder choices to match getter selections