The Journey to Full-Scale Semiconductor Packaging, Part 1: Manufacturability Challenges of Semiconductor Packages for Start-ups

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The journey from concept to full-scale semiconductor packaging is often hindered by a number of different obstacles along the way including everything from diverse teams scattered across the world to simply not understanding how the manufacturing process of die bonding, wire bonding or vacuum reflow impacts the package design and vise versa. In this 3-part series, we will present the challenges faced from package design and prototyping, through process development and process optimization to ensure the device can indeed be manufactured with the desired throughput and quality.

Topics discussed in this webinar:

  • Challenges of manufacturing semiconductor packaging
  • Tips for success with a small teams
  • How to take your package from design to full-scale production

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Journey to full scale semiconductor pkg part 1 Webinar


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