When it comes to the die bonding process for the assembly of RF power transistors, the most important metric is good thermal management. ...

Posted by Palomar Technologies MarCom Team on June 15

One of the great shifts currently taking place in global defense sensor technologies, is due to a fundamental realignment of military ...

Posted by Palomar Technologies MarCom Team on June 1

A traditional means to justify the expense of purchasing new bonding equipment is to calculate the units per hour (UPH) of the proposed ...

Posted by Palomar Technologies MarCom Team on May 17

In Part two of our series on Packaging Technologies meet Quantum Opportunities, Palomar’s Dr. Anthony O’Sullivan interviews Dr. Andrew ...

Posted by Palomar Technologies MarCom Team on April 26

In the early part of 2021, global analysts McKinsey & Company published a number of articles noting that the COVID crisis has led, ...

Posted by Palomar Technologies MarCom Team on April 12

This is the first in a 3-part blog series exploring the world of quantum technologies and its impact on semiconductor packaging. With the ...

Posted by Palomar Technologies MarCom Team on March 29

Much of the semiconductor packaging industry is engaged with an exciting and growing photonics ecosystem. Anticipating seven percent CAGR ...

Posted by Palomar Technologies MarCom Team on March 15

Auxiliary wires are commonly defined as an additional wire outside of a normal ball-to-stitch wire bond. Whether it be a pre-wire, ...

Posted by Palomar Technologies MarCom Team on March 1

“Necessity”, quips the proverb, “is the mother of invention.” Put colloquially, if you are desperate enough to attain a particular goal, ...

Posted by Palomar Technologies MarCom Team on February 15

“New space technologies … will bring about fundamental change that will influence business and our personal lives.” George Whitesides, ...

Posted by Palomar Technologies MarCom Team on February 1