The die bonding, or die attach process, consists of attaching a die/chip to a substrate or package. This attachment can be performed with ...

Posted by Palomar Technologies MarCom Team on November 30

When it comes to microelectronics and photonics packaging assembly, components such as die are placed onto packages. All automated die ...

Posted by Palomar Technologies MarCom Team on November 16

Process development can present many challenges in the die attach market when the optimal process or package design varies drastically. ...

Posted by Palomar Technologies MarCom Team on October 27

Epoxy die attach, sometimes referred to as epoxy die bonding, is the most commonly used die attach method. Whether dispensed or daubed via ...

Posted by Palomar Technologies MarCom Team on August 20

Eutectic die attach involves bonding a chip or die to a surface using a solder alloy. These particular solder alloys are used because of ...

Posted by Palomar Technologies MarCom Team on August 12

With all eyes on 2050 and the mid-century point, a highly ambitious series of global programs are in place to reduce carbon emissions ...

Posted by Palomar Technologies MarCom Team on July 21

In the same way that iron, steam, and the telegraph marked a mega-shift in travel and military technologies for the mid-Victorian era, new ...

Posted by Palomar Technologies MarCom Team on July 1

[For the English version of this blog, please click here.] ...

Posted by Palomar Technologies MarCom Team on June 17

[For the English version of this blog, please click here.] 在本系列的第3篇日志中，我们将介绍在喷射点胶应用的研究成果。正如我们之前在本日志系列的第2篇中所解释的，经过Palomar开发的Fixed ...

Posted by Palomar Technologies MarCom Team on June 10

[For the English version of this blog, please click here.] ...

Posted by Palomar Technologies MarCom Team on June 3