Continuing on with our overview of microelectronic interconnection methods, we will discuss three additional methods: Solder Bump Bonding, ...

Posted by Palomar Technologies MarCom Team on May 24

Quick note: "Other" in the suject is referring to wire bonding and die attach, and the sub-sets that come with them, ie epoxy, eutectic, ...

Posted by Palomar Technologies MarCom Team on May 10

This is Part 3 of our series on Manufacturing in North America. The following case study is an excellent example of North America's low ...

Posted by Palomar Technologies MarCom Team on April 23

Taking from our last post, we determined that the playing field of contract assembly in complex microelectronics, in regards to cost has ...

Posted by Palomar Technologies MarCom Team on January 22

This is the first of a multi-part blog series about North America having become a true competitor in the world of complex microelectronic ...

Posted by Palomar Technologies MarCom Team on January 5

IMAPS 2009 in San Jose was, as expected, slow due to current economic conditions. It was evident that reduced travel budgets and last ...

Posted by Palomar Technologies MarCom Team on November 17

This is Part 3 of the Eutectic Die Bonding 101 series. In the previous 2 blogs, we discussed what "eutectic" means, the variables and ...

Posted by Palomar Technologies MarCom Team on October 23

This is Part 2 of "Eutectic Die Bonding 101". There are 10 process variables that exist, four of which Palomar is in the business of ...

Posted by Palomar Technologies MarCom Team on October 14

Eutectic Bonding - Why is it Necessary? This Eutectic Bond consists of three key aspects: The Electrical Contact The Primary Heat Interface ...

Posted by Palomar Technologies MarCom Team on October 6

For today's MEMS manufacturer, low volume and high complexity are no longer subject to only manual packaging processes. Automation is here, ...

Posted by Palomar Technologies MarCom Team on September 28