The Micro-Electro-Mechanical Systems (MEMS), which once existed only in the university laboratory, are common in many commercial products ...

Posted by Palomar Technologies MarCom Team on September 17

If making an investment in an automated eutectic bonding system, getting the right partners and the right process (the first time) will ...

Posted by Palomar Technologies MarCom Team on August 4

At Semicon West this year, Palomar featured its line of automatic wire bonders, die bonders (automated component placement systems) and ...

Posted by Bruce W. Hueners on July 20

Critical to the LED assembly process is a void-free eutectic solder interface between the diode and its substrate - this provides the ...

Posted by Palomar Technologies MarCom Team on June 17

"Palomarhad its Model 8000 Wire Bonder on display at SMT Nuremburg this year. The name of the show is not fully descriptiveof its real ...

Posted by Palomar Technologies MarCom Team on May 7

The worldwide market for semiconductor optoelectronic components, estimated to be $34.3 billion in 2007, is forecasted to grow by an annual ...

Posted by Palomar Technologies MarCom Team on May 6

LED-based applications are growing and cover a broad range of markets including automotive lighting applications such as indicators, sport ...

Posted by Palomar Technologies MarCom Team on April 28

I came accross an old PPT presentation authored by our CEO back in 1996,titled "Benefits of Automation". I am inspired to share it with you ...

Posted by Palomar Technologies MarCom Team on April 20

Wafer bumping involves putting a conductive material on each die pad on a wafer to attach it to a package or circuit board forming the ...

Posted by Palomar Technologies MarCom Team on April 4

Gold-ball bumping - or stud bumping - can be accomplished with commercially available gold wire bonders using a 1-mil gold wire. In fact, ...

Posted by Palomar Technologies MarCom Team on April 3