Today's production facilities have their own unique set of components, design characteristics and assembly requirements. Before purchasing a new automated die attach machine, a buyer will usually require a proof of performance. This proof of performance comes by way of a demonstration; showing the customer that the assembly equipment will be able to meet their current needs AND show adaptability and flexibility which will meet requirements still in the development stages. Due to the high cost of quality capital equipment, it is important to choose a machine and a vendor that see a customers' big picture needs. If this is not considered, one could run into the problem of having made a significant investment into a machine that works on only 1 or a few applications. 
The requirement for narrow production tolerances is 1-2 mils or better. This is driven by the manufacturers need for consistency, reliability, and quality in highly compact package.
Hybrid circuits and MCMs (mult-chip modules) are often highly populated and densely packed. In some cases, errors slightly larger than +/- 0.5 mil could cause a part to short, overheat, or otherwise malfunction - in other words, the part would be rejected. Accurate component placement is a key factor in maximzing production waste.
When a hybrid/MCM application is highly complex, Palomar's new 3800 die bonder and automated component placement system is challenged to meet a set of performance specifications. A Palomar applications engineer will evaluate the product and process requirements. A test substrate is designed to hold a sampling of components with characteristics and challenges similar to those currently found in the customer's production facility AND those forseen for future production. Components are arranged on a substrate to exercise the vision and dexterity of the die attach machine, its ability to recognize components and to carefully pick, rotate and place them accurately.
When the die bonder is set up to assemble the sample part, the specifications and features for the machine's standard and optional equipment are scruntinized. Basic factors considered for a task are the work envelope (size and features) and machine robotics, computer control and programming capabilities , vision and pattern recognition, dispense options, and component presentation and application options.
The real value provided in the die attached demonstration is the prep work done prior, the process. The process is where the real expertise comes in and where the customer will find a lastly, money making solution. A good die bonder with a good process will in effect, print money.