High-reliability wire bonding traditionally required the addition of a security bond over the stitch—or second bond—of each ball bonded ...

Posted by Palomar Technologies MarCom Team on April 20

Palomar Technologies Assembly Services (“Assembly Services”) offers unique assembly methods supporting flux-less Micro Ball Grid Array ...

Posted by Palomar Technologies MarCom Team on April 13

The semiconductor market has been increasingly expanding in the Asia region—particularity in China—for producers and among consumers. In ...

Posted by Palomar Technologies MarCom Team on April 4

美国PALOMAR 公司成立于1975年,早期隶属于美国休斯航空公司(Hughes Aircraft )的工业产品事业部,主要从事半导体设备的开发与研究.PALOMAR 公司至成立之日就致力于服务美国军工和高科技企业领域高端封装设备的供应.在该领域有70%以上的市场. ...

Posted by Palomar Technologies MarCom Team on March 31

Semiconductor packaging industry experts are continually reworking designs to reduce application package size—however, there remain a ...

Posted by Palomar Technologies MarCom Team on March 21

High power transistor, laser and LED devices require packaging to remove thermal energy from the die. Although some silver filled epoxies ...

Posted by Palomar Technologies MarCom Team on March 12

I think none of us would hesitate to say that things change pretty fast in this modern world. The pace of technology is just staggering. ...

Posted by Palomar Technologies MarCom Team on February 25

One frequently asked question when addressing high-power wire bonding applications is “how many wires do I need?” As a common ...

Posted by Palomar Technologies MarCom Team on February 17

February 4th marks “National Go Red Day” in efforts to raise awareness of heart disease in the US. The statistics of Americans—primarily ...

Posted by on February 4

With the successful deployment of the Pulse Heat Stage (PHS) system from Palomar Technologies, our field sales and engineering teams often ...

Posted by Palomar Technologies MarCom Team on February 1