PTI Blog

Big ROI from Small Footprint Die Bonders

Clean room space is expensive. Obtaining the highest component placement accuracies and the versatility of high-precision application ...

Posted by Palomar Technologies MarCom Team on

MEMS the Word – Recap of MEPTEC MEMS 2011

MEPTEC MEMS, held this year in the heart of San Jose, CA, is traditionally a niche conference with a small exhibit show floor. This ...

Posted by Palomar Technologies MarCom Team on

Ultra High-Reliability Wire Bonding

High-reliability wire bonding traditionally required the addition of a security bond over the stitch—or second bond—of each ball bonded ...

Posted by Palomar Technologies MarCom Team on

Flux-Less Micro BGA Solder Reflow

Palomar Technologies Assembly Services (“Assembly Services”) offers unique assembly methods supporting flux-less Micro Ball Grid Array ...

Posted by Palomar Technologies MarCom Team on

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