PTI Blog

Ultra High-Reliability Wire Bonding

High-reliability wire bonding traditionally required the addition of a security bond over the stitch—or second bond—of each ball bonded ...

Posted by Palomar Technologies MarCom Team on

Flux-Less Micro BGA Solder Reflow

Palomar Technologies Assembly Services (“Assembly Services”) offers unique assembly methods supporting flux-less Micro Ball Grid Array ...

Posted by Palomar Technologies MarCom Team on

SEMICON China 2011 Reflection | Showcasing the 3500-III Die Bonder

美国PALOMAR 公司成立于1975年,早期隶属于美国休斯航空公司(Hughes Aircraft )的工业产品事业部,主要从事半导体设备的开发与研究.PALOMAR 公司至成立之日就致力于服务美国军工和高科技企业领域高端封装设备的供应.在该领域有70%以上的市场. ...

Posted by Palomar Technologies MarCom Team on

AuSi and AuSn Eutectic Die Attach Case Studies

High power transistor, laser and LED devices require packaging to remove thermal energy from the die. Although some silver filled epoxies ...

Posted by Palomar Technologies MarCom Team on

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