Quick note: "Other" in the suject is referring to wire bonding and die attach, and the sub-sets that come with them, ie epoxy, eutectic, bumping, chain, etc.
Picking the Interconnect Method
Every device manufactuter is looking for a more effective and low cost way to assemble their packages. Differences in package complexity, unique requirements to achieve needed precision and accuracy, and desired product volume will determine which interconnect method is most appropriate.
...easier said than done.
Palomar's contract assembly division, Microelectronics, encounters the challenge of "determining the interconnect method" everyday. Taking it a step further, they then execute the interconncect method.
Executing the Interconnect Method
Applications requiring very high precision often need Eutectic bonding - this is because of the "eutectic" method's extraodinary precision and accuracy. If the application requires it, the Microelectronics team does flux-less eutectic attach, creating an even cleaner, more reliable bond (you'd be hard pressed to find another company do flux-less as well as Palomar; a good resource is this paper on eutectic die attach) . 
The applicaiton may require a multiple number of bonding methods to assemble the package. For example, a firm manufacturing microelectronic devices for active optical cables requires several different bonding machines and methods for their process. The process (not in this order) is accomplished by a pick and place bonder using a wafer stage with several thousand sites, an ultra high accuracy die bonder with a Pulse Heat System for making the repeatible eutectic bond (see more on PHS), and finally a versatile wire bonder, performing a low loop interconnection. 
The end product is a highly reliable, complex package that works over long periods of time and in a variety of harsh environments. Each of the bonders are automated, enabling these application processes to happen simutanously with little operator intervention. Meanwhile, engineers and technicians are working on other applications (in the same lab space), and still keeping the process flow moving. Cost goes down, productivity goes up and the end package is impressive, to say the least.
TAB Bonding
Something not mentioned here is TAB Bonding. We don't hear much about it anymore. For this reason I want to discuss it for a moment, in case anyone is in need of some TAB information. TAB stands for "Tape-Automated Bonding". This is an approach to fine the pitch interconnection of a chip to a leadframe. These interconnections are patterned on a multi-layer polymer tape - the tape is positioned above the "bare die". Ths is so that the metal tracks (on the polymer tape) correspond to the bonding sites on the die.