Advanced Packaging Software is arguably where a die or wire bonder is enabled to stretch and accomplish some extraordinary application challenges. We'll be discussing 2 software applications that have elevated complex packaging production efforts to increase yield and lower production costs: Automated Data Management and Analysis (ADMA) and Bond Data Miner (BDM).
ADMA: Global Paperless Production Management
The term "paperless laboratory" was mentioned to me earlier this year during a meeting with an engineer. He was describing the new software architecture that was being implemented in Palomar's contract assembly lab...called Automated Data Management Analysis or ADMA (trademark).
In describing ADMA, he got right to the point he said "a lab's biggest contaniment is people...the majority mistakes come from human error...to the world's manufacturing companies are only spreading out more, and doing so globally...in these far away factories, with management/engineering 10,000 miles away, really good packaging process know how is rarely on the factory floor". By eliminating dirty notebooks and pencils, inputing data into a controlled and clearly mapped out database (via PC), and working through a smart system of work order flow tags, a networked paperless production operation is achieved.
In addition to working with wire and die bonding systems, complementary equipment such as dispensers, inline handlers, magazine hanldlers and test equipment can be included into the ADMA infrastructure. ADMA started out as a solution for Palomar's Microelectronic's lab (the Contract Assembly division of Palomar Technologies). In starting here, it was concieved in real world production environment, not some theoritcal product concept brainstorm. Today ADMA goes beyond Palomar Microelectronics - it is implemented on islands of automation (single bonders) on factory site as well as on multiple systems in multiple locations.
Think of the "Command Center" at NASA. See all the screens and monitors, each tracking different aspects of the space shuttle's lift off: charts on one, goegraphical maps on another, a live feed on yet another, an interactive database on another, and up to the moment information pouring in through each channel... this is an image of how ADMA works, put in the microelectronic packaging context of course.
Take company "XYZ LED": a technician in the Phlippines is operating a 5 machine ultra high accuracy pick and place system, Management is in Washington D.C, Process Engineers are in Germany, the Engineering Manager is traveling in Turkey. Each, from their PCs can enter into the ADMA enviornment remotely and manage the production:
- Management can pull yield data from their desks in the USA
- the Process Engineers can input work orders from Europe
- the Engineering Manager, from his hotel room in Turkey, can closely monitor the System's uptime and provide direction to the Process Engineer
- the Techician in the Phillipines recieves his/her order and simultanously tightens the feeback loop through site ID tracking (finding the error site on 3000 site wafer is a tedious process without this tool)
Bond Data Miner™: just what it says
Bond Data Miner™ or BDM™ was developed first as a tool for Palomar Model 6500 die bonder. As the accuracy of this machine is so precise (1.5 micron), there was a need to find errors that amounted to as .1 micron. Additionally it became clear that both Assembly Services and our customers needed a way to track trend and machine calibrations, aggregate run data and time stamp data sets. Bond Data Miner™ was concieved and then created. The result was a much more comphrensive, centralized data management and analysis system (BDM™ works in concert with ADMA, as a part of ADMA).
Bond Data Miner™ is also unique in that each machine has its own BDM™. In the case of multiple machines, data is pulled from local machines and into the Factory BDM™ database. The Factory BDMdb would reside on a seperate server, along with ADMA. Data can be analyzed locally or by the Factory BDMdb. Like most data software, the information can be copied on a scheduled basis in duplicate or deleted, and be burnt to other hardrives or CDs. All of Bond Data Miner™ databases are stored on RAID drives.
The benefits of this software include on-demand working knowledge Uptime, Trends and Yield.
- Has the calibration drifted?
- Is the machine performing baseling tests with the same result as before?
- What parts, by identifier, went into what assembly?
- What parts had assembly errors? (and will skip in later processes)
- What was the calibration status during a part build?
- What consumables, by identifier, were used during the parts assembly?
- Is the process trending towards Yield loss?
Smart Software = Increase Yield
Why is Yield important? Lets look at what the value of 1% yield is in the following example:
- 12,000 die bumped/year
- $0.50 cost per die
- 1% yield improvement = $60,000 in savings/year
+1% delta Yield = $300,000 in cost savings over 5 years!
