“If you are creating high value hermetically sealed devices, what are the consequences of experiencing high voids in the package seal ...

Posted by Katie Finney on June 21

“If you are creating high value hermetically sealed devices, what are the consequences of experiencing high voids in the package seal ...

Posted by Julia Picarelli on June 7

[View the blog in English here.] 今天, 绝大部分的高生产焊接电子元器件应用都 使用带式焊炉。带式焊炉的典型长度超过20英尺。这些高批量生产流程需要 <200 ppm 氧气水平, 氮气冲洗 (以达到如此低的 ppm 氧气水平) 和恒定的 ...

Posted by Janine Powell on May 30

Microelectronic Mechanical Systems, or MEMS, technology is everywhere we look. The biotech, medical device, communications, and inertial ...

Posted by Janine Powell on May 23

The specialized semiconductor grade graphite tooling manufactured by SST Vacuum Reflow Systems can be used for many years with proper ...

Posted by Julia Picarelli on May 19

Sometimes we get requests from customers or potential customers needing a bonder right away. Of course, we try to do everything we can to ...

Posted by Janine Powell on May 9

MEMS technology is everywhere we look. The Biotech, Medical Device, Communications and Inertial Sensing segments are increasingly using ...

Posted by Julia Picarelli on May 5

In many bonding applications, whether for die attach or wire bond, a successful bond can depend greatly on the method by which the parts ...

Posted by Janine Powell on May 2

Palomar Technologies modern bonding systems have a multi-decade history, with system software that has been continuously improved upon in ...

Posted by Janine Powell on April 25

Today, in the majority of high production soldering of electronic component applications, belt furnaces are used. The typical length of a ...

Posted by Julia Picarelli on April 21