When it comes to microelectronics assembly, there are many challenges and solutions. One of the most critical differences between a manual ...

Posted by Janine Powell on August 1

[For the English version of this blog, click here.] Les interconnexions en câblage filaire dans l’électronique on traditionnellement été ...

Posted by Janine Powell on July 18

Last year, I wrote a blog about general EFO theory. This edition will focus on the history of the “flame-off” and a few more advanced ...

Posted by Janine Powell on July 5

“If you are creating high value hermetically sealed devices, what are the consequences of experiencing high voids in the package seal ...

Posted by Katie Finney on June 21

“If you are creating high value hermetically sealed devices, what are the consequences of experiencing high voids in the package seal ...

Posted by Julia Picarelli on June 7

[View the blog in English here.] 今天, 绝大部分的高生产焊接电子元器件应用都 使用带式焊炉。带式焊炉的典型长度超过20英尺。这些高批量生产流程需要 <200 ppm 氧气水平, 氮气冲洗 (以达到如此低的 ppm 氧气水平) 和恒定的 ...

Posted by Janine Powell on May 30

Microelectronic Mechanical Systems, or MEMS, technology is everywhere we look. The biotech, medical device, communications, and inertial ...

Posted by Janine Powell on May 23

The specialized semiconductor grade graphite tooling manufactured by SST Vacuum Reflow Systems can be used for many years with proper ...

Posted by Julia Picarelli on May 19

Sometimes we get requests from customers or potential customers needing a bonder right away. Of course, we try to do everything we can to ...

Posted by Janine Powell on May 9

MEMS technology is everywhere we look. The Biotech, Medical Device, Communications and Inertial Sensing segments are increasingly using ...

Posted by Julia Picarelli on May 5