The relentless increase in data processing requirements, network/cloud services, computing and web bandwidth advances, and soon-to-be-seen ...

Posted by Janine Powell on November 7

Standard bonding machine pattern recognition vision systems (auto correlation based) today determine their location based on a “pixel to ...

Posted by Janine Powell on October 31

The proliferation of mobile devices, IP traffic, video-on-demand mobile and home, and Internet of Things continues to drive an exponential ...

Posted by Janine Powell on October 25

The Palomar Technologies 8000i Wire Bonder/Ball (Stud) Bumper and 9000 Wedge Bonder both have a good selection of wire bonding “loop modes” ...

Posted by Janine Powell on September 26

Gold ball bumping is primarily used to make interconnects for flip chip bonded die. This process involves placing a single bump (or stacked ...

Posted by Janine Powell on September 12

The market dedicated to optoelectronic packaging with active optical cables and/or optical transceivers is an important one in which ...

Posted by Janine Powell on August 29

[For the English version, click here.] “如果您正在生产高价值的密封元件，在封装密封环中产生高空隙的后果是什么？” 封装密封圈中高度的空隙可能会导致泄漏故障，从而降低元件的可靠性和性能。 ...

Posted by Janine Powell on August 22

When it comes to microelectronics assembly, there are many challenges and solutions. One of the most critical differences between a manual ...

Posted by Janine Powell on August 1

[For the English version of this blog, click here.] Les interconnexions en câblage filaire dans l’électronique on traditionnellement été ...

Posted by Janine Powell on July 18

Last year, I wrote a blog about general EFO theory. This edition will focus on the history of the “flame-off” and a few more advanced ...

Posted by Janine Powell on July 5