In many bonding applications, whether for die attach or wire bond, a successful bond can depend greatly on the method by which the parts ...

Posted by Janine Powell on May 2

Palomar Technologies modern bonding systems have a multi-decade history, with system software that has been continuously improved upon in ...

Posted by Janine Powell on April 25

Today, in the majority of high production soldering of electronic component applications, belt furnaces are used. The typical length of a ...

Posted by Julia Picarelli on April 21

Did you know that Palomar Technologies has thousands of systems installed worldwide and serviced directly by Palomar? Take a look into our ...

Posted by Janine Powell on April 18

Palomar Technologies has exhibited at two large Optoelectronic Technical Conferences in the last 2 months. SPIE Photonics West was held in ...

Posted by Janine Powell on April 11

SST Vacuum Reflow Systems recently exhibited its systems and services at SEMICON China in Shanghai.At the show, we introduced a new ...

Posted by Julia Picarelli on April 7

Whether you are placing components for die attach or creating wire bonds (ball or wedge), a good quality connection requires that the ...

Posted by Janine Powell on March 21

Palomar has successfully worked with the global contract manufacturer Fabrinet over the last several years, working with our mutual ...

Posted by Janine Powell on March 14

Typical applications for the family of SST Vacuum Reflow Systems are: Package Assembly, Lid Attach, Die Attach, Glass to Metal Seals, and ...

Posted by Julia Picarelli on March 10

SST Vacuum Reflow Systems designs and builds systems and processes that achieve low to void-free seals for die attach component parts. ...

Posted by Katie Finney on February 28