[For the English version, click here.] 液体助焊剂 （酸性底或无机底）传统上的主要用途是使氧化的金属表面产生高质量的焊料润, 导致金属零件之间更有效的焊接。然而，使用助焊剂同时也对焊接造成重大的缺陷。 缺陷#1︰ ...

Posted by Janine Powell on February 21

You’ve made an investment in your SST Vacuum Reflow System and want to keep it producing at a high level. To ensure systems operate at peak ...

Posted by Julia Picarelli on February 17

The semiconductor industry saw the highest-ever annual sales in 2016, totaling $338.9 billion, according to the Semiconductor Industry ...

Posted by Janine Powell on February 14

There are many different directions to go in when it comes to part presentation stages—from that simple part built by the thousands yearly, ...

Posted by Janine Powell on January 31

After investing in a sophisticated and complex piece of capital equipment, you expect to maximize its performance and minimize life-cycle ...

Posted by Julia Picarelli on January 27

Selecting the right solder alloy for your application is crucial to the success of the project. If the right solder alloy is not selected ...

Posted by Janine Powell on January 24

[Read the English version of the blog here.] Bien que la tendance évolue défavorablement envers le fil d’or dans le câblage de grande ...

Posted by Janine Powell on January 17

Liquid flux (acidic base or inorganic based) has traditionally been the primary solution to allow soldering of metal parts with surface ...

Posted by Janine Powell on January 10

Wire bonding is a well-known process that has been around for many decades. It was all performed manually from the mid-1950s to the late ...

Posted by Janine Powell on January 3

To say that 2016 has been an interesting year is probably an understatement for most of us in the electronics business. The pace of change ...

Posted by Julia Picarelli on December 30