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Video Demos of Fully Automated High-Accuracy
Die Bonding and Hi-Rel Wire Bonding

Hi-Rel Wire Bonding Ball Bumps, FABs, Chain Bonding and Complex Looping Profiles	3800 Die Bonder Fully Automatic, High-Accuracy Die Attach System
6500 Die Bonder Ultra-High Precision and WSP Die Attach System	8000 Wire Bonder Fully Automated Hi-Rel Wire Bonder and Ball Bumping System
Ease of Use - 3800 Die Bonder Operate the Most Advanced Precision Die Bonder with Ease	Deep Access Wire Bonding Odd-Form Factor Packaging Requiring Access with a 0.750" Capillary
Wafer Scale Packaging Fully Automatic Wafer Scale Packaging and Advanced Microelectronics Assembly	Steady State Eutectic Die Attach Steady State Eutectic Die Attach on a LED Application
Laser Diode Assembly Micron-level Anatomy of a Laser Diode Package	Precision Epoxy Dispensing Dots, Lines, Circles, Spirals & Serpentine Patterns