High-Reliability Component Attachment Process
for <5µm Placement Accuracy

 

Cost: FREE

 


 

 

 

 

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Abstract:
As complex microelectronic packaging designs and components mature, improved placement accuracy becomes increasingly more important. High-accuracy placement has been an ongoing theme in the commercial assembly arena for several years. For example, some phononic designs require better than 2µm precision placement for optimum performance.

Military and aerospace companies routinely evaluate higher precision requirements, although this has been traditionally accomplished using semi-automatic bonder equipment. A manual or semi-automatic process is adequate and often perceived as essential for prototyping; however, semi-automatic processes are not practical for higher volume production. Aside from the slower speed of semi-automatic equipment, application performance relies on how well the technician can target the die since these systems mainly require manual alignment.

Listen in as Donald Beck, Palomar Technologies Assembly Services™ general manager, presents a process solution for automating sub-5µm component attach specific to organizations requiring high-reliability device packaging. In this webinar, Mr. Beck will cover methods that have been proven through real-world experiences related to the high-reliability microelectronics industry.

 

Automated Precision Assembly for High-Volume HB LEDs

Cost: FREE     

 


 

 

 

 

 

 

 

 

 

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Abstract:

Since the introduction of the first automated die and wire bonders in the 1980s, equipment manufacturers and process engineers have been challenged to balance speed with repeatability. Today, die bonders can perform epoxy die attach at a rate of 1.5 to 4 thousand die per hour; and wire bonders can interconnect complex packages at speeds greater than 10 wires per second. However, there are major concerns with operating at these speeds. The advantage of automation is speed and consistency—which can, consequently, also mean if something in the assembly process is wrong, everything will be wrong. Having a tightly regulated process flow helps avoid the risk of building a large batch of rejected product in a short period of time.

Listen in as Palomar Technologies Assembly Services™ general manager, Donald Beck, presents a process flow for high yield HB LED automated assembly, supported by equipment certification, product inspection and SPC data collection methods. Over the past five years, Mr. Beck has managed the development of several cutting edge microelectronic LED light modules, taking this new technology from prototype to high-volume production. The methods presented in this webinar have been formulated through extensive work in the high-reliability microelectronics industry and commercial production lines over the last three decades. To ensure product and time-to-market success in high-volume, high-reliability commercial HB LED production, specific methods to achieve throughput and quality are required. This webinar will cover the ultimate goal of an automated precision HB LED assembly—to blend the quality required to support high reliability with the speed needed to support high-volume commercial production.