High-Reliability Component Attachment Process
for <5µm Placement Accuracy
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Military and aerospace companies routinely evaluate higher precision requirements, although this has been traditionally accomplished using semi-automatic bonder equipment. A manual or semi-automatic process is adequate and often perceived as essential for prototyping; however, semi-automatic processes are not practical for higher volume production. Aside from the slower speed of semi-automatic equipment, application performance relies on how well the technician can target the die since these systems mainly require manual alignment.
Listen in as Donald Beck, Palomar Technologies Assembly Services™ general manager, presents a process solution for automating sub-5µm component attach specific to organizations requiring high-reliability device packaging. In this webinar, Mr. Beck will cover methods that have been proven through real-world experiences related to the high-reliability microelectronics industry.